IPQ4019

IPQ4019 SoC

Wave-2 802.11ac SoC for Routers, Gateways and Access Points

The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-in....

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The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-in....

more

The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-e....

more

The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-effective network infrastructure products.

IPQ4019 is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Specifications

CPU

CPU Clock Speed: 717MHz

CPU Cores: 4x ARM Cortex A7, Quad-core CPU

DSP

DSP Technology: SIMD DSP

Wi-Fi

Peak Speed: 1.733 Gbps

Standards: 802.11ac Wave 2, 802.11n, 802.11ac, 802.11p

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

Wi-Fi Features: MU-MIMO, TxBF, Qualcomm® Wi-Fi SON

Channel Utilization: 20/40/80 MHz, 5/10/20/40 MHz

MIMO Configuration: 2x2 (2-stream)

RF

Ethernet: 5-port ethernet

Security Support

Security Features: Crypto Engine, Qualcomm® Trusted Execution Environment (TEE), Secure Boot

Wi-Fi Security: WPA, WPS, 802.11i security, AES-CCMP, AES-GCMP, PRNG, TKIP, WAPI, WEP, WPA2

Memory

Memory Type: DDR3L

RAM: 1 GB RAM

Interfaces

Supported Interfaces: I²S, I²C, Ethernet, JTAG, LCD, PCIe 2.0, PCM, RGMII, SD/eMMC, SPDIF, SPI, UART, USB 2.0, USB 3.0

Process

Process Node and Technology: 40 nm

Package

Package Type: BGA

Size: 18 x 18 mm

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