Qualcomm Dragonwing™
QCM2290
Contact sales
Q2

The robust entry level Qualcomm Dragonwing™ QCM2290 system-on-chip (SoC) delivers blazing fast LTE connectivity, enhanced GPS and advanced camera features.

The Qualcomm Dragonwing™ QCM2290 is robust entry-level offering, enabling reliable performance and power-conservation with upgraded features and memory support for low power consumption in its tier. Equipped with the Cortex A53 CPU architecture, the entry-level application processor is a cost-effective solution, delivering greater performance, higher graphics capabilities, better quality images, and improved power performance. The Qualcomm Dragonwing™ QCM4290 is well-suited for, retail point-of-sale (POS), industrial handheld, tracking and camera applications.

Qualcomm Dragonwing™ QCM2290 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Product license agreement
Featured Documents Product Brief
Benefits
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Powerful CPU and GPU in its tier

Reliable performance and power-conservation; 11nm process node offers improved power performance

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Flexible connectivity solutions

From Bluetooth to Wi-Fi or 4G LTE, the Qualcomm Dragonwing QCM2290 supports a range of connectivity options. With Qualcomm Dragonwing QCM2290, compatibility with virtually any band supported by global cellular operators enables devices to stay connected from almost anywhere.*
*Requires a network connection and a compatible network.

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Accelerate time to commercialization

The Qualcomm Dragonwing QCM2290 baseband chipset is pin-to-pin compatible with Qualcomm Dragonwing QCM4290 which helps customers leverage hardware and software development across various IoT devices to reduce cost and time to commercialization.

QCM2290 block diagram

Specifications
Qualcomm® Artificial Intelligence (AI) Engine
GPU Name
Qualcomm® Adreno™
CPU Name
Qualcomm® Kryo™
Qualcomm® Hexagon™ Processor Features
Fused AI Accelerator architecture
Qualcomm® Sensing Hub Features
Dual-core AI processor
CPU
Name
Qualcomm® Kryo™
Architecture
64-bit
Clock Speed
2.0 GHz
GPU
Name
Qualcomm® Adreno™ 702
APIs
OpenGL® ES 3.1
Memory
Speed
4200 MHz
Type
LPDDR5x
Audio
Qualcomm Aqstic™ technology support
Qualcomm Aqstic™ smart speaker amplifier
Qualcomm® aptX™ audio technology support
Qualcomm® aptX™ Voice
Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support
Qualcomm® cVc™ Echo Cancelling and Noise Suppression
Audio Capturing Technologies
Qualcomm® Voice Suite
  1. Subject to change without notice. Refer to the Product Longevity Program page for the latest information.

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1 of 3 total products

Product

CPU

Name

Number of Cores

Clock Speed

GPU

Name

Clock Speed

DSP

Name

Wi-Fi

Generation

Standards

MIMO Configuration

Bluetooth

Specification Version

Display

Number of Concurrent Displays

Interface Type

Interfaces

Supported Interfaces

Software Options

Operating System

Memory

Speed

Type

Process Node and Technology

Process Node

Qualcomm® Dragonwing™ Q6 Series

QCM6490
Active

Qualcomm® Kryo™ 670
Qualcomm® Kryo™ CPU

8

Up to 2.4 GHz

Qualcomm® Adreno™ 643L

Up to 812 GHz

Qualcomm® Hexagon™

Wi-Fi 6E

802.11ac
802.11n
802.11ax
802.11g
802.11b

2x2

Bluetooth® 5.2

2

USB-C with DisplayPort
2x PCIe
USB 3.1
USB 2.0

2x PCIe
USB-C with DisplayPort
USB 2.0
USB 3.1

Android
Linux
Windows
Ubuntu

4200 MHz

LPDDR5x

6 nm

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