--- title: "QCM2290" url: "https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290" description: "Well-suited for retail point-of-sale (POS), industrial handheld, tracking and camera applications." --- # QCM2290 Qualcomm Dragonwing™ Contact Sales Save to Workspace On this page - [Introduction](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#overview) - [Benefits](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#benefits) - [Block Diagram](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#blockdiagram) - [Product Longevity Program](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#productlongevityprogram) - [Features / Specs](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#specs) - [Product Comparison](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#comparison) The robust entry level Qualcomm Dragonwing™ QCM2290 system-on-chip (SoC) delivers blazing fast LTE connectivity, enhanced GPS and advanced camera features. The Qualcomm Dragonwing™ QCM2290 is robust entry-level offering, enabling reliable performance and power-conservation with upgraded features and memory support for low power consumption in its tier. Equipped with the Cortex A53 CPU architecture, the entry-level application processor is a cost-effective solution, delivering greater performance, higher graphics capabilities, better quality images, and improved power performance.* The Qualcomm Dragonwing™ QCM2290 is well-suited for retail point-of-sale (POS), industrial handheld, tracking and camera applications. *Compared to previous generations Qualcomm Dragonwing™ QCM2290 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries. [Product license agreement](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290) **Featured Documents** [Qualcomm Dragonwing QCS2290/QCM2290 Processors Product Brief](https://docs.qualcomm.com/doc/87-28731-1/87-28731-1_REV_E_Qualcomm_Dragonwing_QCS2290_QCM2290_Processors_Product_Brief.pdf) ## Benefits - **Powerful CPU and GPU in its tier** Reliable performance and power-conservation; 11nm process node offers improved power performance - **Flexible connectivity solutions** From Bluetooth to Wi-Fi or 4G LTE, the Qualcomm Dragonwing™ QCM2290 supports a range of connectivity options. With Qualcomm Dragonwing™ QCM2290, compatibility with virtually any band supported by global cellular operators enables devices to stay connected from almost anywhere.* *Requires a network connection and a compatible network. - **Accelerate time to commercialization** The Qualcomm Dragonwing™ QCM2290 baseband chipset is pin-to-pin compatible with Qualcomm Dragonwing™ QCM4290 which helps customers leverage hardware and software development across various IoT devices to reduce cost and time to commercialization. ### QCM2290 Block Diagram https://s7d1.scene7.com/is/image/dmqualcommprod/qcm2290-block-diagram-v2.svg ## Product Longevity Program **Product Longevity Program** This product is a part of the Product Longevity Program for Qualcomm IoT Portfolio. These products are developed and engineered with product longevity and durability in mind, helping to bring stability to our customer product designs. [Learn more about the program](https://www.qualcomm.com/products/product-longevity-program) https://s7d1.scene7.com/is/image/dmqualcommprod/product-longevity-program-icon-180x180?$QC_Responsive$&fmt=png-alpha ## Features - Customized 64-bit Arm Cortex-A53 quad-core applications processor at up to 2.0 GHz - Dedicated DSP shared between sensor core and low-power audio subsystem - Qualcomm® Adreno™ GPU 702 @ 845 MHz, 3D graphics accelerator with 64-bit addressing - Dual-channel non-PoP high-speed memory LPDDR4x SDRAM designed for 1804 MHz clock (2 × 16 bit) LPDDR3 SDRAM designed for 933 MHz clock (1 × 32 bit) - Qualcomm® Universal Bandwidth Compression (UBWC) with GPU - Display support: HD+, 720 × 1680 at 60 Hz, 10 bit end-to-end, and up to four hardware layer composition. Features Qualcomm® Low-Power Picture Enhancement and Qualcomm® True Palette Display - One 4-lane DSI D-PHY 1.2 at 1.5 Gbps per lane, split link supported - 2x ISP (13 MP + 13 MP or 25 MP) at 30 fps ZSL - Two 4-lane CSIs (4/4 or 4/2/1) D-PHY 1.2 at 2.5 Gbps per lane or C-PHY 1.0 at 10 Gbps (3.42 Gbps/trio) - Support for USB 3.1 Type-C/Micro USB - Always-on subsystem with RPM for power management - Long term support with extended life hardware and software support through 2034 ### Specifications #### Qualcomm® Artificial Intelligence (AI) Engine | Field | Value | | --- | --- | | GPU Name | Qualcomm® Adreno™ | | CPU Name | Qualcomm® Kryo™ | | Qualcomm® Hexagon™ Processor Features | Fused AI Accelerator architecture | | Qualcomm® Sensing Hub Features | Dual-core AI processor | #### CPU | Field | Value | | --- | --- | | Name | Qualcomm® Kryo™ | | Architecture | 64-bit | | Clock Speed | Up to 2.0 GHz | #### GPU | Field | Value | | --- | --- | | Name | Qualcomm® Adreno™ 702 | | Clock Speed | 845 MHz | | APIs | OpenGL® ES 3.1 | #### Memory | Field | Value | | --- | --- | | Speed | 1804 MHz[1](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote1), 933 MHz[2](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote2) | | Type | LPDDR4x[1](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote1), LPDDR3[2](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote2) | | Bit Width | 16-bit[1](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote1), 32-bit[2](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote2) | | Number of Channels | 1[2](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote2), 2[1](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290#footnote1) | #### Audio | Field | Value | | --- | --- | | Qualcomm Aqstic™ technology support | Qualcomm Aqstic™ smart speaker amplifier | | Qualcomm® aptX™ audio technology support | Qualcomm® aptX™ Voice | | Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support | Qualcomm® cVc™ Echo Cancelling and Noise Suppression | | Audio Capturing Technologies | Qualcomm® Voice Suite | 1. LPDDR4x @ 1804 MHz; 2 x 16 bit 2. LPDDR3 @ 933 MHz; 1 x 32 bit 3. Subject to change without notice. Refer to the Product Longevity Program page for the latest information. Show more ## Compare related products. Note: to leverage the best experience for the product comparison table, please use the desktop to view content. Show All Filters Customize Columns 1 of 3 total products | Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | Qualcomm® Dragonwing™ Q6 Series | | | | | | | | | | | | | | | | | | | [QCM6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcm6490) Active | Qualcomm® Kryo™ 670 Qualcomm® Kryo™ CPU | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 643L | Up to 812 MHz | 4200 MHz | LPDDR5x | Qualcomm® Hexagon™ | 2 | USB-C with DisplayPort 2x PCIe USB 3.1 USB 2.0 | 2x PCIe USB-C with DisplayPort USB 2.0 USB 3.1 | Android Linux Windows Ubuntu | Wi-Fi 6E | 802.11ac 802.11n 802.11ax 802.11g 802.11b | 2x2 | Bluetooth® 5.2 | 6 nm |