Snapdragon S7 Gen 1 Sound Platforms

Snapdragon S7 Sound Gen 1 Platforms

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Overview

Benefits

Features / Specs

Sound reimagined

The Snapdragon S7 and S7+ Gen 1 Sound Platforms are our most advanced audio platforms ever. They deliver 6 times more compute power, and almost 100 times the AI power of previous generation platforms. They have been designed to deliver a new premium tier of performance unlike anything listeners have heard before.

These platforms deliver an unparalleled level of on-device AI and premium audio technologies including Qualcomm^® 4th Generation Active Noise Cancellation (ANC), Hearing Loss Compensation and personal sound amplification...

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Featured Documents Product Brief

Next level audio performance

A completely new architecture provides powerful compute, with almost 100x more on-device AI, 3x more memory, and significantly more DSP power, to help ignite a new era of audio innovation.

On-device AI

Powerful on-device AI maximizes audio performance and enhances the user experience for many different use cases. The data is processed locally on device for security and peace of mind, and enhanced power management ensures that you get the best performance and experience from your device, with no compromise on battery life.

Immersive sound

Qualcomm^® 4th Generation Active Noise Cancellation and all-new hardware architecture supports low-latency, multi-channel and low-power active noise cancellation. For the user this means our strongest ever ANC performance, regardless of variations in earbud fit, resulting in a consistent ANC experience for all users. Advanced Adaptive Transparency mode is also supported for situations when users need to be aware of what is going on around them. ANC transitions seamlessly with Hearing Loss Compensation and personal sound amplification technologies so users can focus on what’s important to them, staying connected with family, friends and colleagues even in extremely noisy environments.

Untethered audio experiences

With Qualcomm XPAN technology devices are designed to seamlessly switch from a direct connection to your phone, or laptop, instead connecting via Wi-Fi access points when out of Bluetooth range, staying connected via Wi-Fi as you walk around your home, building or campus, whether you are listening to music or making calls.

Enhanced sound

With Snapdragon Sound and Qualcomm XPAN technology, up to 192kHz lossless music streaming can be delivered over micro-power Wi-Fi, so listeners can hear every detail of their music in stunning audiophile quality. The micro-power Wi-Fi and XPAN technology will also deliver unprecedented bandwidth at low latency, which combined with AI-driven sensor compute capabilities, enable a step change in head-tracking latency for unparalleled immersive spatial experiences.

Wi-Fi connectivity at micro-power

The Snapdragon S7+ Sound Platform includes a world-class Wi-Fi solution that works alongside Qualcomm XPAN technology to extend the capability and range of audio devices far beyond what is possible with only Bluetooth, whilst maintaining the ultra-low power performance we have come to expect from earbuds and headsets.

Features

All new platform architecture unlocks a new tier of performance at ultra-low power
Almost 100 times more AI compute power than the Qualcomm S5 Gen 2 Sound Platform
3x more memory than the Qualcomm S5 Gen 2 Sound Platform
A step-change in DSP – 1.5GHz total audio compute (50%+ improvement on previous Qualcomm S5 Gen 2 Sound Platform)
Dedicated AI core - to provide higher performance and lower power for ML applications compared to using the DSP
Dedicated cores for audio curation including hearing loss compensation, ANC, transparency and noise management
Qualcomm® 4th Generation Adaptive Active Noise Cancellation 112 biQuad filters combined with fully programmable 3uSec low latency DSP to enable personalized and responsive audio curation
HiFi-grade stereo audio codec
Bluetooth 5.4 radio
Bluetooth® LE Audio experiences, including Auracast™ Broadcast Audio
High-performance audio combined with low-power consumption, designed for Snapdragon Sound
USB High Speed PHY at 480 Mbps which unlocks enhanced Audio Development workflows
Non-invasive low-level debug through use of Qualcomm USB-EUD
Enhanced memory and peripheral data sharing across subsystems for lower latency, higher throughputs
DMIC, I2S, TDM, Soundwire digital audio interfaces
Fully integrated system including PMU, Charger, mic bias, and external supply support
Integrated Flash - Qualcomm QCC7226 includes 128Mb integrated flash and Qualcomm QCC7228 incudes 256 Mb

Snapdragon S7+ Sound Platform additional features

Wi-Fi connectivity at micro-power
Support for Qualcomm XPAN for whole home and building coverage
Seamless transitions to Wi-Fi from Bluetooth
Data rates of up to 29Mpbs, supporting Snapdragon Sound and delivering up to 24-bit 192kHz lossless music streaming over Wi-Fi
The Qualcomm QCP7321 micro power Wi-Fi device partners alongside either the QCC7226 or QCC7228

Specifications

CPU

Clock Speed

300 GHz

DSP

Clock Speed

2x 500 GHz

Flash

Location

Internal

Bluetooth

Specification Version

Bluetooth® 5.4

Connection Technology

Bluetooth® Low Energy, Bluetooth® Classic, Dual-mode Bluetooth®

Topologies

Qualcomm TrueWireless™ Mirroring technology

Classic Data Rate

2 MBps, 3 MBps, 1 MBps

Low Energy Data Rate

1 MBps, 2 MBps

Low Energy Features

Bluetooth® Auracast™ Broadcast Audio, Bluetooth® Low Energy Audio

Wi-Fi

Features

Qualcomm® XPAN technology1

S7 Pro Gen 1 Sound Platform
Base consumption
Music streaming

University Relations Program

As mobile technologies continue to advance, our university research partnerships play an important role in identifying and developing forward-thinking ideas and solutions. The University Relations program at Qualcomm also focuses on supporting the recruitment of talented graduates.