The QCC3007 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with...
The QCC3007 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with...
The QCC3007 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.
The QCC3007 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to...
The QCC3007 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.
The QCC3007 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.
A single-chip dual-mode Bluetooth 5 system, QCC3007 SoC features 8th generation Qu...
QCC3007, Qualcomm cVc, Qualcomm TrueWireless and Qualcomm Kalimba are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
Cost-effective, single-chip flash programmable platform solution
QCC300x includes low-power audio DSP with on-chip ROM and RAM, audio codec, battery charger, switch mode and linear regulators, and LED drivers all in one chip. It is optimized to support reduced development time with its fixed-function and customizable SoCs.
Support for Over-the-Air updates
Over-the-Air (OTA) update of external Flash supports updates of file partitions of the external Quad SPI Flash. Combine multiple features, for example update voice prompts or make updates to the application running in external Flash memory.
8th generation cVc noise cancellation technology
cVc technology is a suite of algorithms designed to work on the transmit and receive paths to help deliver optimum audio quality and echo cancellation on headsets, speakers, speakerphones, and other hands-free devices.
QCC3007 Block Diagram
Features
- Dual-mode Bluetooth 5 qualified radio
- Variants designed to address both headsets/headphones and speaker applications
- Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single chip solution
- Customizable application code
- Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology
- A rich set of features, use cases and programmability at more cost-effective price points
- Pin compatible with CSRA64xxx family of products
- Integrated Qualcomm TrueWireless Stereo technology
- Qualcomm® meloD™ Expansion audio processing: 3D stereo widening
- SBC and AAC codecs
- Promotes reduced development time with support of application image and source code, IDE and configuration
- Updated Generic Application Interface Architecture (GAIA) protocol v3
Qualcomm Kalimba, Qualcomm TrueWireless, Qualcomm aptX, Qualcomm meloD, GAIA, CSRA3xxx and CSRA64xxx are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
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