immersivehome platform

Immersive Home 216 Platform

Qualcomm Immersive Home 216 is a dual-band, 6-stream networking platform featuring a novel modular architecture, advanced network packet processing, and next-generation Wi-Fi 6 to power immersive home networking experiences.

The next generation successor to our groundbreaking mesh networking platforms, Qualcomm Immersive Home Platforms are designed to deliver Gigabit-speed wireless performance to every....

more

The next generation successor to our groundbreaking mesh networking platforms, Qualcomm Immersive Home Platforms are designed to deliver Gigabit-speed wireless performance to every....

more

The next generation successor to our groundbreaking mesh networking platforms, Qualcomm Immersive Home Platforms are designed to deliver Gigabit-speed wireless performance to every room in the home with devices that fit in the palm of the hand.

A 4x4 Wi-Fi 6 configuration in the 5GHz band delivers enhanced performance, range, and/or client count for the Imme....

more

The next generation successor to our groundbreaking mesh networking platforms, Qualcomm Immersive Home Platforms are designed to deliver Gigabit-speed wireless performance to every room in the home with devices that fit in the palm of the hand.

A 4x4 Wi-Fi 6 configuration in the 5GHz band delivers enhanced performance, range, and/or client count for the Immersive Home 216.

Plus, advanced Qualcomm® Multi-User Traffic Management technologies balance and support all the Wi-Fi connected devices in a modern smart home, while high-performan....

more

Qualcomm Immersive Home 216 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Featured Documents
Product Brief

High-Performance Wi-Fi 6

Experience up to 6 spatial streams simultaneously supporting our differentiated Wi-Fi 6 feature portfolio including Qualcomm Multi-User Traffic Management with algorithmic optimizations leveraging OFDMA in both the uplink and downlink across the 2.4 and 5GHz bands delivering corner-to-corner Gigabit class connectivity.

Advanced Intelligence

The Qualcomm Immersive Home 216 platform delivers our signature network intelligence for local computing and connectivity coexistence, centralizing smart home interfaces like voice assistance and emergent technologies like RF sensing to finally deliver a truly immersive smart home experience.

Application Optimization

Utilizing innovative modular platform architecture, this platform is built to be small enough to go unnoticed, scalable in design to deploy densely for every size home, and powerful enough to support the demands of today’s smart home network.

Features

  • Qualcomm Multi-User Traffic Management provides advanced scheduling algorithms and buffering with universal uplink data support.

  • Qualcomm® Wi-Fi Security Suite offers the most comprehensive WPA3 implementation coupled with state-of-the-art embedded crypto accelerators designed to provide secure transactions across a full range of Wi-Fi data touchpoints.

  • Carrier-grade enhancements with open API porting for multi-source development.

  • Mesh Wi-Fi options include Qualcomm® Wi-Fi SON, the Wi-Fi Alliance’s Wi-Fi CERTIFIED EasyMesh™ standard, and the OpenSync™ open-source software.

  • Advanced local computing using dual-core A53 processors paired with powerful network accelerators.

Specifications

CPU

CPU Clock Speed: 1.0GHz

CPU Cores: Dual-core Cortex-A53 ARM

Wi-Fi

Spatial Streams: Up to 6

Peak Speed: 5.4 Gbps

Standards: Wi-Fi 6, Wi-Fi 5, 802.11a/b/g/n

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

Wi-Fi Features: 160MHz channel support, MU-MIMO, OFDMA, Target Wake Time, TxBF, Qualcomm® Wi-Fi SON, Wi-Fi Alliance’s Wi-Fi CERTIFIED EasyMesh™

Security Support

Wi-Fi Security: WPA2, WPS, 802.11i security, WPA3 Easy Connect, WPA3-Enhanced Open, WPA3-Enterprise, WPA3-Personal, AES-CCMP, AES-GCMP, PRNG, TKIP

Memory

Flash: SPI NOR, NAND

Interfaces

Platform extensions: Bluetooth 5.1

Supported Interfaces: PCIe 2.0 x 1, SGMII+, eMMC, PCIe 2.0 x 2, NAND, I²S, I²C, SDIO, SPI, UART, USB 2.0, USB 3.0

Package

Size: 14 x 14 mm

  1. Peak PHY rate

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