High-End Soundbar Platform

High-End Soundbar Platform

The development kit for the High-End Soundbar example design contains nearly everything required for rapid evaluation and development of a high-end 3.1ch Soundbar with HDMI, SPDIF and wired analog inputs, Bluetooth, wireless Subwoofer, extended Post Processing, including Qualcomm® meloD™ audio processing, standard and HD decoders up to Dolby TrueHD and DTS-HD as well as an infrared remote control.

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High-End Soundbar Platform Specs

Audio

Audio Technology

  • Qualcomm® aptX™ codec technology
  • Dolby Digital decoding

HDMI Support

  • 2 input
  • 1 output

Channel Output

  • 3.1

Bluetooth

Bluetooth Version

  • Bluetooth 4.1

Bluetooth Technology

  • Bluetooth Low Energy

Bluetooth Profiles

  • AVRCP v1.4
  • A2DP v1.2

NFC

Near Field Communications

  • Supported

USB

USB Version

  • USB 2.0

DSP

DSP Technology

  • MAPX audio DSP

Interface

Supported Interfaces

  • UART
  • USB 2.0
  • SPDIF
  • SPI
  • I²C

    CSR8670 Specs

    Bluetooth

    Bluetooth Version

    • Bluetooth 4.1

    Maximum Output Power

    • 10dBm transmitter

    Bluetooth Radio

    • 50Ω
    • -90dBm receiver sensitivity

    Class Support

    • Class 3
    • Class 2
    • Class 1

    USB

    USB Version

    • USB 2.0

    Audio

    Audio Technology

    • Qualcomm® aptX™ codec technology
    • Qualcomm® cVc™ audio technology
    • HD Voice
    • Qualcomm TrueWireless™ Technology

    Analog Microphone Input

    • 2 analog mics

    Digital Microphone Input

    • 6 digital mics

    Equalizer

    • 5-band EQ

    Microphone Bias Generator

    • 2 microphone bias generators

    DSP

    DSP Technology

    • Qualcomm® Kalimba™ DSP

    DSP Bit Architecture

    • 24-bit

    MCU

    MCU Clock Speed

    • 80MHz

    Power Management

    Maximum Input Voltage

    • 3.3V

    Charging

    Maximum Current

    • 200 mA

    Memory

    RAM

    • 56KB RAM

    Flash

    • 16MB
    • Up to 64 MB external flash

    Interface

    Supported Interfaces

    • UART
    • USB 2.0
    • Master and slave bit-serializer
    • PCM
    • I²S
    • SPDIF

    Input/Output

    ADC

    • 2 ADCs

    DAC

    • 1 DAC

    General Purpose IOs

    • 14

    Maximum PIOs

    • 29

    PWM (LED)

    • 3

    Input

    Touch Sensor Inputs

    • 6 touch sensor inputs

    Package

    Package Type

    • 6.5 x 6.5 x 1 mm 0.5 mm pitch VFBGA