CSR8811

CSR8811

The CSR8811 chipset is a Bluetooth v4.2 single-chip radio and baseband IC for consumer electronics devices.

The CSR8811 chipset is a Bluetooth v4.2 single-chip radio and baseband IC for consumer electronics devices.

The CSR8811 chipset is a Bluetooth v4.2 single-chip radio and baseband IC for consumer electronics devices.

The CSR8811 chipset is a Bluetooth v4.2 single-chip radio and baseband IC for consumer electronics devices.

CSR8811 and Qualcomm BlueCore are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Specifications

Bluetooth

Bluetooth Version: Bluetooth 4.2

Bluetooth Technology: Bluetooth Low Energy, CSRmesh™ technology, Dual-mode Bluetooth

Bluetooth Profiles: HFP v1.6

Maximum Output Power: Up to +9dBm

Bluetooth Radio: 50Ω, -95dBm receiver sensitivity

Class Support: Class 3, Class 2, Class 1

USB

USB Version: USB 2.0

Power Management

Maximum Input Voltage: 5.5V

Interface

Supported Interfaces: I²S, PCM, UART, USB 2.0

Operating Temperature Range

Maximum Temperature: 85°C

Minimum Temperature: -30°C

Package

Package Type: QFN, WLCSP

Pitch: 0.5mm Pitch

Package Size: 2.57 x 3.21 x 0.6 mm, 6 x 6 x 0.9 mm

  1. WLCSP
  2. QFN

©2020 Qualcomm Technologies, Inc. and/or its affiliated companies.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell any of the components or devices referenced herein.