Overview | Qualcomm CSR8675 SoC | Low-Power Audio Headset Chipset

Embedded Flash Solution for Premium Bluetooth Audio Applications

CSR8675 is a premium tier single-chip solution delivering high quality wireless audio performance and supporting the development of highly differentiated premium wireless audio pro....

CSR8675 is a premium tier single-chip solution delivering high quality wireless audio performance and supporting the development of highly differentiated premium wireless audio products. Integrated support for aptX, aptX HD, Active Noise Cancellation and Qualcomm TrueWireless stereo.

CSR8675, Qualcomm Kalimba, Qualcomm aptX, Qualcomm cVc and Qualcomm TrueWireless are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Integrated single-chip solution for smaller designs

Application processor, Bluetooth and Bluetooth low energy radios, DSP and memory integrated into a single SoC helps reduce system complexity and eBOM while supporting small form factor designs.

Comprehensive ADK software support for easy application development

The software development environment with integrated Bluetooth and audio applications, reference designs and tuning tools supports reduced development time.

aptX HD for a high-definition audio experience

Optional support for 24-bit audio and aptX HD for high resolution audio performance that is comparable to wired.

CSR8675 Block Diagram

Features

Bluetooth version 4.2 compliant
120 MHz programmable Kalimba DSP with integrated multipoint A2DP and HFP audio applications
aptX, aptX Low Latency, aptX HD, MP3, AAC and SBC audio codecs
2-mic Qualcomm® cVc™ 8th Generation Noise Cancellation Technology with wideband speech
Audio tuning suite with audio enhancements and two 5-band EQs
GAIA V2 and associated Android & iOS example apps for enhanced connectivity with mobile devices
Link Layer Topology support for enhanced multi-device co-existence
Qualcomm TrueWireless™ Stereo
Two I2S ports for enhanced audio connectivity capabilities with external components
Support for Apple MFi1 & Apple ANCS for enhanced communication with iOS devices
Qualcomm® meloD™ Audio Processing stereo widening technology
Compatible with third party solutions available from selected eXtension Program members

Specifications

DSP

DSP Technology: Qualcomm® Kalimba™ DSP

DSP Clock Speed: 120MHz

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Radio: +10dBm maximum output power (typical), -90dBm receiver sensitivity (basic rate, typical)

USB

USB Version: USB 2.0 (Full Speed)

USB Support: Supports USB charger detection

General Audio

Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® Broadcast Audio technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology, 24 bit audio data path

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™, Qualcomm® aptX™ HD, Qualcomm® eXtension program

Audio Playback

Sampling, Playback: 192kHz

Channel output: 2 analog DAC channels

Audio Recording

Sampling, Record: Up to 192kHz/24bit

Microphone: 2 analog mics, 2 microphone bias generators, Up to 6 digital mics

Charging

Maximum Current: 200 mA on chip, 500 mA with external transistor

Memory

Flash: 16 MB internal flash, Up to 64 MB external flash

Interface

Supported Interfaces: Master I²C, 2x SPDIF, 2x PCM/I²S, UART

Input/Output

General Purpose I/Os: 32x

ADC: 2 ADCs

DAC: 2 DACs

PWM (LED): 3

Input

Touch Sensor Inputs: 6 touch sensor inputs

Package

Package Type: VFBGA, WLCSP

Pitch: 0.5mm Pitch

Package Size: 4.8 x 4.8 x 0.6 mm, 6.5 x 6.5 x 1 mm

Up to 192 kHz sample rate
Up to 96 kHz sample rate
WLCSP
VFBGA

Development tools and purchase options.

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CSR8675C-ICXT-R BY QUALCOMM

Chip Product

CSR8675 (CSR8675C-ICXT-R), 79BWLCSP, \CSR8675 BLUETOOTH DEVICE, EMBEDDED FLASH, WLCSP PACKAGE\ RICK (1.2.0), TSMC

CSR8675C-ICXT-H BY QUALCOMM

Chip Product

CSR8675 (CSR8675C-ICXT-R), 79BWLCSP, \CSR8675 BLUETOOTH DEVICE, EMBEDDED FLASH, WLCSP PACKAGE\ RICK (1.2.0), TSMC

CSR8675C-IBBH-R BY QUALCOMM

Chip Product

CSR8675 (CSR8675C-IBBH-R), 112CSP, \CSR8675 BLUETOOTH DEVICE, EMBEDDED FLASH, 6.5MM X 6.5MM BGA IC\ RICK (1.2.0), TSMC

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