Embedded Flash Solution for Premium Bluetooth Audio Applications
CSR8675 is a premium tier single-chip solution delivering high quality wireless audio performance and supporting the development of highly differentiated premium wireless audio pro....
CSR8675 is a premium tier single-chip solution delivering high quality wireless audio performance and supporting the development of highly differentiated premium wireless audio pro....
CSR8675 is a premium tier single-chip solution delivering high quality wireless audio performance and supporting the development of highly differentiated premium wireless audio products. Integrated support for aptX, aptX HD, Active Noise Cancellation and Qualcomm TrueWireless stereo.
CSR8675 is a premium tier single-chip solution delivering high quality wireless audio performance and supporting the development of highly differentiated premium wireless audio products. Integrated support for aptX, aptX HD, Active Noise Cancellation and Qualcomm TrueWireless stereo.
CSR8675, Qualcomm Kalimba, Qualcomm aptX, Qualcomm cVc and Qualcomm TrueWireless are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
Application processor, Bluetooth and Bluetooth low energy radios, DSP and memory integrated into a single SoC helps reduce system complexity and eBOM while supporting small form factor designs.
The software development environment with integrated Bluetooth and audio applications, reference designs and tuning tools supports reduced development time.
Optional support for 24-bit audio and aptX HD for high resolution audio performance that is comparable to wired.
Bluetooth version 4.2 compliant
120 MHz programmable Kalimba DSP with integrated multipoint A2DP and HFP audio applications
aptX, aptX Low Latency, aptX HD, MP3, AAC and SBC audio codecs
2-mic Qualcomm® cVc™ 8th Generation Noise Cancellation Technology with wideband speech
Audio tuning suite with audio enhancements and two 5-band EQs
GAIA V2 and associated Android & iOS example apps for enhanced connectivity with mobile devices
Link Layer Topology support for enhanced multi-device co-existence
Qualcomm TrueWireless™ Stereo
Two I2S ports for enhanced audio connectivity capabilities with external components
Support for Apple MFi1 & Apple ANCS for enhanced communication with iOS devices
Qualcomm® meloD™ Audio Processing stereo widening technology
Compatible with third party solutions available from selected eXtension Program members
DSP
DSP Technology: Qualcomm® Kalimba™ DSP
DSP Clock Speed: 120MHz
Bluetooth
Bluetooth Version: Bluetooth 5.0
Bluetooth Radio: +10dBm maximum output power (typical), -90dBm receiver sensitivity (basic rate, typical)
USB
USB Version: USB 2.0 (Full Speed)
USB Support: Supports USB charger detection
General Audio
Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® Broadcast Audio technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology, 24 bit audio data path
Qualcomm® aptX™ audio playback support: Qualcomm® aptX™, Qualcomm® aptX™ HD, Qualcomm® eXtension program
Audio Playback
Sampling, Playback: 192kHz
Channel output: 2 analog DAC channels
Audio Recording
Sampling, Record: Up to 192kHz/24bit
Microphone: 2 analog mics, 2 microphone bias generators, Up to 6 digital mics
Charging
Maximum Current: 200 mA on chip, 500 mA with external transistor
Memory
Flash: 16 MB internal flash, Up to 64 MB external flash
Interface
Supported Interfaces: Master I²C, 2x SPDIF, 2x PCM/I²S, UART
Input/Output
General Purpose I/Os: 32x
ADC: 2 ADCs
DAC: 2 DACs
PWM (LED): 3
Input
Touch Sensor Inputs: 6 touch sensor inputs
Package
Package Type: VFBGA, WLCSP
Pitch: 0.5mm Pitch
Package Size: 4.8 x 4.8 x 0.6 mm, 6.5 x 6.5 x 1 mm
Chip Product
Chip Product
Chip Product
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