CSR8640 | Qualcomm

Bluetooth® audio ROM platform with Qualcomm® cVc™ noise cancellation technology for entry level to mid-range audio devices.

The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level ....

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The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level ....

more

The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level to mid-range wireless audio products with support for voice and music. The CSR8640 is part of the CSR86xx portfolio, a range of silicon platforms for wireless audio applications wh....

more

The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level to mid-range wireless audio products with support for voice and music. The CSR8640 is part of the CSR86xx portfolio, a range of silicon platforms for wireless audio applications which integrate a dual-mode Bluetooth radio, a low power DSP, an application processor, a battery charger, memory and various audio and hardware interfaces into a single-chip solutio....

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CSR8640, Qualcomm cVc and Qualcomm Kalimba are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Ideal for entry-level to mid-range wireless audio products

The CSR8640 SoC has a reduced feature set supporting the essential features expected from Bluetooth audio products while providing cost efficiency for entry-level products.

Integrated single-chip solution for smaller designs

Application processor, Bluetooth and Bluetooth low energy radios, DSP and memory integrated into a single SoC helps reduce system complexity and eBOM while supporting small form factor designs.

No software development required

Pre-loaded Bluetooth and audio applications allow manufacturers to develop end-products without writing code, while customization tools support quick modification of device behaviour and user interface.

cVc 6th generation 2-mic audio technology

cVc technology is a suite of algorithms designed to work on the transmit and receive path of voice calls to deliver optimum voice quality on Bluetooth headsets, handsets, hands-free devices, and automotive.

CSR8640 Block Diagram

Features

Bluetooth 4.0 specification compliant
Flexible ROM-based platform with fully configurable MMI and tool chain
Support for various profiles including: HFP 1.6, A2DP 1.2 AVRCP 1.4
80MHz Qualcomm® Kalimba™ DSP with integrated multipoint A2DP and HFP audio applications
2-mic cVc 6th Generation voice processing technology with wideband speech
Audio tuning suite with audio enhancements and 5-band EQs
Internal ROM, serial flash memory and EEPOM interfaces
MP3, AAC and SBC audio codecs
GAIA V1 and associated Android and iOS apps for connectivity with mobile devices
Reference speaker and headset applications pre-loaded on the ROM
Fast charging support up to 200mA with no external components
Pin compatible with CSR8645

Specifications

DSP

DSP Technology: Qualcomm® Kalimba™ DSP

MCU

MCU Clock Speed: 80MHz MCU

Bluetooth

Bluetooth Version: Bluetooth 4.1

Bluetooth Profiles: HFP v1.6, AVRCP v1.4, A2DP v1.2, DI v1.3, HSP v1.2

A2DP multipoint support: 2 A2DP sources

Bluetooth Radio: Up to +9dBm output power (typical), -92dBm receiver sensitivity (basic rate, typical)

USB

USB Version: USB 2.0 (Full Speed)

USB Support: Supports USB charger detection

General Audio

Audio Technology: HD Voice, Voice recognition technology, Qualcomm® cVc™ audio technology, Talk-Time Extension

Equalizer: 5-band EQ

HFP multipoint support: 2 handsets

Audio Recording

Microphone: 2 analog mics, 1 microphone bias generator, 2 digital mics

Power Management

Maximum Input Voltage: 3.3V

Charging

Maximum Current: 200 mA on chip, 500 mA with external transistor

Memory

RAM: 56 KB RAM

Interface

Supported Interfaces: I²S, I²C, PCM, SPI, UART, USB 2.0

Input/Output

ADC: 2 ADCs

DAC: 1 DAC

Maximum PIOs: 22

PWM (LED): 3

Package

Package Type: VFBGA

Pitch: 0.5mm Pitch

Package Size: 5.5 x 5.5 x 1 mm