3D Sonic Max
3D Sonic Max
3D SonicMax

The world’s largest Ultrasonic In-Display Fingerprint Sensor.

Using sound waves to read two fingers simultaneously, our Qualcomm® 3D Sonic Max transmits an ultrasonic pulse against the fingers. The 3D pulse reflection creates a detailed 600mm2 reproduction of the scanned fingerprints for quick and higher security performance.

Qualcomm 3D Sonic Sensor is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Product license agreement
Benefits
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Sleek security solution

Integrating the Qualcomm 3D Sonic Max fingerprint reader behind a smartphone's display enables a seamless and sleek look. 3D Sonic uses technological advances and acoustics (sonic waves) to scan the pores of a user's finger for a deeply accurate image. The ultra-thin (0.2 mm) sensor enables cutting-edge form factors such as full glass edge-to-edge displays, and can be widely used with flexible OLED displays.

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Anti-spoofing security

Safeguard a user's identity with the most advanced fingerprint security system available. Qualcomm 3D Sonic Max uses acoustic-based technology that reflects the unique features of a user's individual fingerprint vs. optical solutions, which leaves users exposed to spoofing. With Anti-spoofing built in, 3D Sonic meets the highest security standards for mobile devices, rejecting imposter photographs and fake mold of your finger.

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High-performance

Qualcomm 3D Sonic Max delivers high-performance across a wide range of operating conditions—dry, wet, and even contaminant exposure—and it's faster compared to legacy solutions when fingers are wet.

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Force Sensing

Force Sensing allows phone apps and UI buttons to detect how hard you press on the smartphone display. This means developers can add new experiences to their lock screen and applications. Racing games, for example, can use 3D Sonic Max as the acceleration pedal or lightly tap for the brakes. Force Sensing combined with the Fingerprint Sensor can also function as an instant unlock and shortcut to your favorite app or the Home Screen. 

Specifications
Package
Size
20 × 30 mm
Thickness
150 µm
Security
Fingerprint Sensor
Qualcomm® 3D Sonic Sensor Gen 2
Biometric Authentication
Fingerprint
Features
Biometric Authentication
Part
Part Number(s)
QFS2630
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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