Superior connectivity
Provide ease of installation, interoperability and compatibility for everything from simply pairing Bluetooth headphones to a smartphone, to automating a home.
To fuel the next technological advancement, we continue to innovate, develop, and push the limits of what Bluetooth-enabled products are capable of achieving.
By offering extended range, application optimization, and a comprehensive development environment for easy integration, our Bluetooth innovations can help your products stand out in a crowded marketplace.
Provide ease of installation, interoperability and compatibility for everything from simply pairing Bluetooth headphones to a smartphone, to automating a home.
Our latest iteration of Qualcomm Bluetooth mesh, a Low Energy Mesh technology, is the first commercially available solution to use a Bluetooth Mesh network that permits management and calibration of multiple beacons, as well as tracking and report assets.
Qualcomm® aptX™ audio technology supports high-quality wireless audio, bringing pro-audio quality to consumer electronic devices.
Qualcomm Bluetooth mesh extends the range of Bluetooth wireless technology by turning Bluetooth-enabled devices into a mesh network for the Internet of Things.
aptX audio helps to enhances the wireless sound quality in many of the top audio brands for smartphones, speakers, sound bars, headphones and tablets.
Qualcomm® cVc™ noise cancelation technology is a suite of algorithms that is designed to work on the transmit and receive path of voice calls to deliver optimum voice quality on Bluetooth headsets, handsets, hands-free devices, and automotive.
Qualcomm TrueWireless™ Stereo technology is designed to eliminate the need for wires entirely–not only between the media source and stereo headset, but also between the left and right earbuds.
The way we listen to music is changing. Consumers are demanding advanced wireless audio technology: high-res audio in compact, wireless form factors, smart speakers with virtual assistants, and more. We believe that audio products equipped with our Bluetooth technology are the foundation and future of this growing, innovative market.

| Product |
|---|
QCC300x Product Family Chipset |
QCC30xx Series Product Series |
| Bluetooth Version | Bluetooth Technology | Bluetooth Profiles | Audio Technology | Qualcomm® aptX™ audio playback support | Package Type | Package Size |
|---|---|---|---|---|---|---|
Bluetooth 5.0 | Dual-mode Bluetooth | Qualcomm TrueWireless™ Technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | aptX Classic aptX HD | BGA124 WLCSP81 | 4.1 x 4.1 x 0.54mm 1 6.5 x 6.5 x 1.0mm 2 | |
Bluetooth 5.0 | Dual-mode Bluetooth | A2DP v1.3 AVRCPv1.5 HFP v1.7 | Qualcomm TrueWireless™ Technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | |||
Bluetooth 5.0 | Bluetooth Low Energy sensor hub Dual-mode Bluetooth | Qualcomm TrueWireless™ Stereo Plus technology Qualcomm TrueWireless™ Stereo technology Qualcomm® Broadcast Audio technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | aptX Classic aptX HD | QFN VFBGA WLCSP | 3.98 x 4.02 x 0.5 mm 8 x 8 x 0.85 mm 5.5 x 5.5 x 1 mm |
Our Bluetooth low-energy products for IOT are designed for a wide range of applications including remote controllers, smart watches, wearable products, home automation products, indoor location services and a wide range of consumer electronics products. The portfolio of products balance performance, battery life, extensive and flexible I/O interfaces and are designed to simplify implementation in an OEM design. Features include low power consumption, support for mesh networking, multiple radios and a software development kit (SDK) that integrates a host of Bluetooth profiles. The latest in the Bluetooth Low Energy (BLE) family, QCA4024 is a multi-radio SOC that integrates 802.15.4 and BLE 5.0 in a single package.

| Product |
|---|
QCA4024 SoC |
QCA4020 SoC |
CSR8811 Chipset |
CSR101x Series Chipset |
CSR102x Series Chipset |
| CPU Clock Speed | Wi-Fi Standards | Bluetooth Version | Package Type | Pitch | Package Size |
|---|---|---|---|---|---|
Up to 128 MHz | Bluetooth 5.0 | QFN | 0.4mm Pitch | 8 x 8 mm | |
Up to 128 MHz | 802.11a/b/g 802.11n | Bluetooth 5.0 | BGA | 0.65mm Pitch | 11.2 x 11.2 mm |
Bluetooth 4.2 | QFN WLCSP | 0.5mm Pitch | 6 x 6 x 0.9 mm 2 2.57 x 3.21 x 0.6 mm 3 | ||
Bluetooth 4.1 | QFN 4 UT-WLCSP 5 | 0.4mm Pitch 0.5mm Pitch | 2.43 x 2.56 x 0.35mm 4 x 4 x 0.6mm 5 x 5 x 0.6mm 8 x 8 x 0.9 mm | ||
Bluetooth 4.2 | QFN 6 LGA 7 | 0.5mm Pitch | 5 x 5 x 0.65 mm 5 x 5 x 0.75mm 8 x 8 x 0.65mm 8 x 8 x 0.75mm |
Qualcomm aptX, Qualcomm cVc, QCA4024, Qualcomm TrueWireless and CSRmesh are products of Qualcomm Technologies, Inc. and/or its subsidiaries.