APQ8096SG

APQ8096SG

The Qualcomm® APQ8096SG application processor features leading-edge premium mobile technology for powering next-generation devices, while supporting the ultimate in performance and....

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The Qualcomm® APQ8096SG application processor features leading-edge premium mobile technology for powering next-generation devices, while supporting the ultimate in performance and....

more

The Qualcomm® APQ8096SG application processor features leading-edge premium mobile technology for powering next-generation devices, while supporting the ultimate in performance and power efficiency, ideal for small form factors and a wide variety of innovative and intelligent IoT applications.

The Qualcomm® APQ8096SG application processor features leading-edge premium mobile technology for powering next-generation devices, while supporting the ultimate in performance and power efficiency, ideal for small form factors and a wide variety of innovative and intelligent IoT applications.

Qualcomm APQ8096SG is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Highly integrated platform for compact designs

The high level of integration aims to reduce the bill-of-material (BOM) supporting board-area savings. The package-on-package implementation adds LPDDR4 SDRAM memory without increasing a device’s footprint or PCB area.

Powerful multi-core processing

The combination of the powerful Qualcomm® Adreno™ 530 GPU and quad-core Qualcomm® Kryo™ CPU expand the possibilities of connected computing while providing the ultimate in performance, power efficiency and high quality visual experiences.

Next-generation computer vision

Enhanced object detection and navigation functionality allows recognition and tracking of multiple objects to navigate and perform dynamic collision avoidance in commercial drones and robots.

Immersive, life-like virtual reality

Realistic visual and audio immersion and smooth VR/AR action are enabled by the heterogeneous computing of Qualcomm APQ8096SG designed for high performance and long battery life.

Features

  • Customized quad-core Kryo 64-bit CPU supports maximum performance and low power consumption

  • Fabricated using the advanced 14 nm FinFET process for low active power dissipation & fast peak CPU performance

  • 28MP camera support (zero shutter lag) via dual 14-bit ISP

  • Dual-channel PoP high-speed memory – LPDDR4 SDRAM @1866MHz clock rate

  • Hardware assisted (HEVC/H.265) 4K Ultra HD video capture, streaming and playback

  • Adreno 530 GPU with 64-bit addressing @653MHz with latest API support

  • Qualcomm® Hexagon™ 680 DSP with dedicated Sensor Core to support always-on low power use cases with direct access to internal cores

  • Fast-track deployment path for embedded device OEMs and developers— utilizing SoMs and SBCs available now from technology providers

Specifications

CPU

CPU Clock Speed: Up to 2.34 GHz

CPU Cores: Qualcomm® Kryo™ CPU, Quad-core CPU

CPU Architecture: 64-bit

Process

Process Technology: 14 nm

DSP

DSP Technology: Qualcomm® Hexagon™ DSP

Wi-Fi

Wi-Fi Standards: 802.11ac

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

MIMO Configuration: 2x2 (2-stream)

Wi-Fi Features: MU-MIMO

Bluetooth

Bluetooth Version: Bluetooth 4.2

Location

Satellite Systems Support: GLONASS, GPS

Location Support: Qualcomm® Location

USB

USB Version: USB 3.0, USB 2.0

Camera

Image Signal Processor: 2x Image Signal Processor (ISP)

Single Camera: Up to 28 MP

Slow Motion Video Capture: 4K Ultra HD @ 60 FPS

Video

Video Playback: Up to 4K Ultra HD video playback @ 60 fps

Codec Support: H.265 (HEVC), H.264 (AVC)

Display

UI FPS: 3840x2400, Up to 60 FPS

Concurrent Displays: Up to 3; 2 panels + external

GPU

GPU Name: Qualcomm® Adreno™ 530 GPU

API Support: OpenGL ES GEP, OpenCL™ 2.0 Full, GL4.4, RenderScript-Next, DX11.3/4, Path Rendering, OpenGL ES 3.1, OpenGL ES 3.0

Security Support

Security Features: Secure Boot, Secure code signing service

Memory

Memory speed: 1866MHz

Memory Type: LPDDR4, Dual-Channel

Storage

eMMC: eMMC 5.1

UFS: UFS 2.0

SD: SD 3.0 (UHS-I)

Interface

Supported Interfaces: I²S, SLIMbus, TSIF, MIPI-CSI, MIPI-DSI, PCIe 2.0, PCM, USB 2.0, USB 3.0

Package

Package Type: NSP

Pins: 994 pins

Pitch: 0.4mm Pitch

Package Size: 15.6 x 15 x 0.64mm

  1. Gold Cluster = 2x high-performance Kryo cores up to 2.15GHz, Silver Cluster = 2x low power Kryo cores up to 1.593GHz
  2. Does not include memory device

Qualcomm Adreno, Qualcomm Kryo, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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