Integrated CPU, GPU, Wi-Fi/WLAN, Bluetooth, DSP and memory integrated into a single SoC helps reduce system complexity while supporting small form factor designs.
Superior CPU architecture is capable of both 32-bit and 64-bit processing—designed for an improved user experience.
The video core of Qualcomm APQ8016E supports popular codecs including H.264, MPEG4, MPEG2 and VC1 for better software compatibility.
Qualcomm® Adreno™ 306 GPU supports OpenGL ES 3.0, and DirectX 9.3 for next-generation media players.
Quad-core Arm Cortex A53 up to 1.2GHz with both 32-bit and 64-bit support — commercialized in millions of mobile devices worldwide
Arm v8-A ISA offers an efficient instruction set
Adreno A306 3D GPU (up to 400MHz) with support for multiple APIs including: OpenGL ES 3.0, OpenCL, DirectX, content security, and decreased power consumption
Qualcomm® Hexagon™ QDSP6 V5 (up to 691MHz) for differentiated signal processing
13MP camera support with Wavelet Noise Reduction and JPEG Decoder done in hardware
Worldwide ecosystem of vendors, customers, developers and embedded device OEMs
CPU Clock Speed: Up to 1.2 GHz
CPU Cores: 4x ARM Cortex A53, Quad-core CPU
CPU Architecture: 64-bit, 32-bit
DSP Technology: Qualcomm® Hexagon™ QDSP6 V5
DSP Clock Speed: Up to 691 MHz
Wi-Fi Standards: 802.11a/b/g, 802.11n
Bluetooth Version: Bluetooth 4.1
Bluetooth Technology: Bluetooth Low Energy
Satellite Systems Support: GPS
USB Version: USB 2.0
Image Signal Processor: Image Signal Processor (ISP)
Megapixel Support: Up to 13 MP camera
Video Capture: Up to 1080p video capture @30 FPS
Video Playback: Up to 1080p video playback
Codec Support: H.264 (AVC)
Maximum On-Device Display Support: 1920x1200
Maximum External Display Support: Up to 1080p
GPU Name: Qualcomm® Adreno™ 306 GPU
API Support: OpenGL ES 3.0
Security Features: Secure code signing service, Secure Boot
Memory speed: 533 MHz
Memory Type: LPDDR2, LPDDR3
eMMC: eMMC 4.5
SD: SD 3.0 (UHS-I)
Supported Interfaces: LVDS, HDMI, HSIC, MIPI-CSI, MIPI-DSI, SDIO, USB 2.0
Package Type: NSP
Pitch: 0.4mm Pitch
Package Size: 12 x 14 mm
Qualcomm Snapdragon, Qualcomm Adreno and Qualcomm Hexagon are trademarks of Qualcomm Technologies, Inc. and/or its subsidiaries.