The APQ8009 processor is engineered to support industry-standard Bluetooth and Wi-Fi connectivity alongside quad-core processing power, supplemented by lowpower Qualcomm® Hexagon™ DSP processing and an Qualcomm® Adreno™ GPU, for IoT applications.
Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.
The APQ8009....
Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.
The APQ8009....
Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.
The APQ8009 has a high level of integration that reduces the bill-of-material (BOM) and board area. The cost and time-tocommercialization advantages of this SoC is designed to help drive wire....
Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.
The APQ8009 has a high level of integration that reduces the bill-of-material (BOM) and board area. The cost and time-tocommercialization advantages of this SoC is designed to help drive wireless broadband adoption in mass markets around the world.
Qualcomm Smart Audio Platform and APQ8009 are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Higher integration helps to reduce PCB surface area, time to-commercialization, and BOM costs while adding more capabilities and processing power.
Integrated application processors and hardware cores eliminate multimedia co-processors, providing superior image quality and resolution for mobile devices while extending application times
Integrated support for 802.11a/b/g/n, WI-FI, Bluetooth and Bluetooth Low Energy connectivity
The heterogeneous architecture of the APQ8009 SoC is designed to allow applications to utilize the full spectrum of specialized processors within in order to maximize
performance and power efficiency.
Adreno 304 GPU 3D graphics accelerator (up to 456 MHz) with latest API support
Hexagon 536 DSP designed to provide battery-efficient audio/video use cases
Heterogeneous architecture includes 32-bit, quad-core Arm Cortex-A7 CPU @ up to 1.3GHz per core
Fabricated using the advanced 28 nm LP CMOS process
Qualcomm® Location Suite Gen 8C; support for three bands concurrently:
Integrated 802.11a/b/g/n, Bluetooth 4.1 low energy and GPS support
Provides dedicated support for industryleading codecs and other multimedia formats to support carrier deployments around the world.
Worldwide ecosystem of QTI vendors, customers, developers and embedded device OEMs
Wi-Fi
Wi-Fi Standards: 802.11ac with MU-MIMO, 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4GHz, 5GHz
Peak Speed: 364 Mbps
MIMO Configuration: 2x2 (2-stream)
Wi-Fi Features: MU-MIMO
Bluetooth
Bluetooth Version: Bluetooth 4.1
Bluetooth Technology: Bluetooth Low Energy
Location
Satellite Systems Support: Beidou, GLONASS, GPS, GNSS
RF
RFFE: Qualcomm® RF Front-End (RFFE) solution
CPU
CPU Clock Speed: Up to 1.3 GHz
CPU Cores: 4x ARM Cortex A7, Quad-core CPU
CPU Architecture: 32-bit
Process
Process Technology: 28 nm LP
DSP
DSP Technology: Qualcomm® Hexagon™ 536 DSP
Camera
Image Signal Processor: 2x Image Signal Processor (ISP)
Single Camera: Up to 16 MP
Video Capture (30 FPS): 720p video capture
Video
Video Playback: Up to 1080p video playback
Codec Support: H.265 (HEVC), H.264 (AVC)
Display
Max On-Device Display: 720p
General Audio
Audio Technology: Qualcomm Aqstic™ audio technology
GPU
GPU Name: Qualcomm® Adreno™ 304 GPU
Security Support
Security Features: Qualcomm® Content Protection, Qualcomm® Processor Security
Qualcomm Processor Security, Qualcomm Content Protection, Qualcomm RF Front-End, Qualcomm Aqstic, Qualcomm Hexagon, and Qualcomm Adreno are products of Qualcomm Technologies, Inc. and/or its subsidiaries. SOMs and development kits are made available through approved third-party distributors.
Other
©2021 Qualcomm Technologies, Inc. and/or its affiliated companies.