APQ8009

APQ8009

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The APQ8009 processor is engineered to support industry-standard Bluetooth and Wi-Fi connectivity alongside quad-core processing power, supplemented by lowpower Qualcomm® Hexagon™ DSP processing and an Qualcomm® Adreno™ GPU, for IoT applications.

Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.

The APQ8009....

more

Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.

The APQ8009....

more

Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.

The APQ8009 has a high level of integration that reduces the bill-of-material (BOM) and board area. The cost and time-tocommercialization advantages of this SoC is designed to help drive wire....

more

Its quad-core Arm Cortex-A7 application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.

The APQ8009 has a high level of integration that reduces the bill-of-material (BOM) and board area. The cost and time-tocommercialization advantages of this SoC is designed to help drive wireless broadband adoption in mass markets around the world.

Qualcomm Smart Audio Platform and APQ8009 are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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Product Brief

Single platform design

Higher integration helps to reduce PCB surface area, time to-commercialization, and BOM costs while adding more capabilities and processing power.

Superior image quality and resolution

Integrated application processors and hardware cores eliminate multimedia co-processors, providing superior image quality and resolution for mobile devices while extending application times

Integrated connectivity support

Integrated support for 802.11a/b/g/n, WI-FI, Bluetooth and Bluetooth Low Energy connectivity

Maximized performance and power efficiency

The heterogeneous architecture of the APQ8009 SoC is designed to allow applications to utilize the full spectrum of specialized processors within in order to maximize
performance and power efficiency.

Features

  • Adreno 304 GPU 3D graphics accelerator (up to 456 MHz) with latest API support

  • Hexagon 536 DSP designed to provide battery-efficient audio/video use cases

  • Heterogeneous architecture includes 32-bit, quad-core Arm Cortex-A7 CPU @ up to 1.3GHz per core

  • Fabricated using the advanced 28 nm LP CMOS process

  • Qualcomm® Location Suite Gen 8C; support for three bands concurrently:

    • GPS, BeiDou and GLONASS or
    • GPS, BeiDou and Galileo

  • Integrated 802.11a/b/g/n, Bluetooth 4.1 low energy and GPS support

  • Provides dedicated support for industryleading codecs and other multimedia formats to support carrier deployments around the world.

  • Worldwide ecosystem of QTI vendors, customers, developers and embedded device OEMs

Specifications

Wi-Fi

Peak Speed: 364 Mbps

Wi-Fi Standards: 802.11ac with MU-MIMO, 802.11a/b/g, 802.11n

Wi-Fi Spectral Bands: 2.4GHz, 5GHz

MIMO Configuration: 2x2 (2-stream)

Wi-Fi Features: MU-MIMO

Bluetooth

Bluetooth Technology: Bluetooth Low Energy

Bluetooth Specification Version: Bluetooth 4.1

Location

Satellite Systems Support: Beidou, GLONASS, GPS, GNSS

RF

RFFE: Qualcomm® RF Front-End (RFFE) solution

CPU

CPU Clock Speed: Up to 1.3 GHz

CPU Cores: 4x ARM Cortex A7, Quad-core CPU

CPU Architecture: 32-bit

Process

Process Node and Technology: 28 nm LP

DSP

DSP Technology: Qualcomm® Hexagon™ 536 DSP

Camera

Image Signal Processor: 2x Image Signal Processor (ISP)

Single Camera: Up to 16 MP

Video Capture (30 FPS): 720p video capture

Video

Video Playback: Up to 1080p video playback

Codec Support: H.264 (AVC), H.265 (HEVC)

Display

Max On-Device Display: 720p

Audio

Qualcomm® Aqstic™ technology: Qualcomm Aqstic™ audio technology

GPU

GPU Name: Qualcomm® Adreno™ 304 GPU

Security Support

Security Features: Qualcomm® Content Protection, Qualcomm® Processor Security

    Qualcomm Processor Security, Qualcomm Content Protection, Qualcomm RF Front-End, Qualcomm Aqstic, Qualcomm Hexagon, and Qualcomm Adreno are products of Qualcomm Technologies, Inc. and/or its subsidiaries. SOMs and development kits are made available through approved third-party distributors.

    Development tools and purchase options.

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    PAH8011ES: Low Power Heart Rate Monitor Optical Chip BY PIXART IMAGING INC.

    Other

    PAH8011ES is a low power and high-performance CMOS optical chip with integrated DSP, targeted for use in Heart Rate Detection (HRD). It is based on optical sensing technology that captures higher resolution image than traditional photodiode. The PAH8011ES supports three external discrete LEDs, typically two Green and one IR as illumination light source. The images captured are then processed within the integrated DSP to attain PPG (Photoplethysmogram) data, for use in deducing Heart Rate.

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    Purpose-built platforms using the APQ8009 processor.

    Qualcomm® Smart Audio 200 Platform

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