The Qualcomm Dragonwing™ APQ8009 processor is engineered to support industry-standard Bluetooth and Wi-Fi connectivity alongside quad-core processing power, supplemented by lowpower Qualcomm® Hexagon™ DSP processing and an Qualcomm® Adreno™ GPU, for IoT applications.
Its quad-core application processor helps expand mass-market chipset capabilities to make rich multimedia features accessible to more consumers worldwide.
The APQ8009 has a high level of integration that reduces the bill-of-material (BOM) and board area. The cost and time-tocommercialization advantages of this SoC is designed to help drive wireless broadband adoption in mass markets around the world.
Qualcomm Smart Audio Platform and APQ8009 are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Features
- Adreno 304 GPU 3D graphics accelerator (up to 456 MHz) with latest API support
- Hexagon 536 DSP designed to provide battery-efficient audio/video use cases
- Heterogeneous architecture includes 32-bit, quad-core CPU @ up to 1.3GHz per core
- Fabricated using the advanced 28 nm LP CMOS process
- Qualcomm® Location Suite Gen 8C; support for three bands concurrently:
- GPS, BeiDou and GLONASS or
- GPS, BeiDou and Galileo
- Integrated 802.11a/b/g/n, Bluetooth 4.1 low energy and GPS support
- Provides dedicated support for industryleading codecs and other multimedia formats to support carrier deployments around the world.
- Worldwide ecosystem of QTI vendors, customers, developers and embedded device OEMs
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Product | Applications Product Applications | IoT Processing | IoT Smart Home | IoT Voice and Music Applications | Bluetooth Connection Technology | Bluetooth Specification Version | Cellular Modem-RF Performance Enhancement Technologies | Location Satellite Systems | Wi-Fi Features | Wi-Fi Generation | Wi-Fi MIMO Configuration | Wi-Fi Peak Speed | Wi-Fi Peak Speed (range) | Wi-Fi Spatial Streams | Wi-Fi Spectral Bands | Wi-Fi Standards | Audio Qualcomm Aqstic™ technology support | Camera Image Signal Processor (ISP) Number | Camera Single Camera | Camera Video Capture | Display Maximum On-Device Display Resolution | Video Playback Codecs | Video Playback Resolution | Process Node and Technology Process Node | Process Node and Technology Technology | CPU Architecture | CPU Clock Speed | CPU Number of Cores | DSP Name | GPU Name | Product Function Application Processors | Product Function Audio Components | Security Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Other | |||||||||||||||||||||||||||||||||
IoT | Application Processing | Smart Appliances | Smart Speakers | Bluetooth® Low Energy | Bluetooth® 4.1 | Qualcomm® RF Front-End (RFFE) solution | Beidou | MU-MIMO | Wi-Fi 4 | 2x2 | Up to 364 Mbps | 300-999 Mbps | Up to 2 | 2.4 GHz | 802.11ac | Qualcomm Aqstic™ audio technology | Dual ISP | Up to 16 MP | Up to 720p @ 30 fps | 720p | H.265 (High Efficiency Video Coding (HEVC)) | Up to 1080p | 28 nm | LP | 32-bit | Up to 1.3 GHz | 4 | Qualcomm® Hexagon™ 536 | Qualcomm® Adreno™ 304 | IoT | Processors | Qualcomm® Content Protection |
