Press Release

Qualcomm Opens Qualcomm Communication Technologies in Shanghai for Semiconductor Test Manufacturing

Expands Qualcomm Technologies, Inc.’s relationship with Amkor Technology, Inc. to combine semiconductor manufacturing expertise with product engineering and development

Sep 12, 2016SAN DIEGO

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (NASDAQ: QCOM) today announced the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first foray into providing manufacturing services for semiconductors. By working with Amkor Technology, Inc., one of the world’s leading providers of contract semiconductor assembly and test services, the new company will combine Amkor’s extensive test services experience and state of the art cleanroom facilities with Qualcomm Technologies’ industry leadership in cutting-edge product engineering and development.

The new manufacturing facility demonstrates Qualcomm Technologies’ commitment to continue to invest and help develop semiconductor expertise in China, and is indicative of growth in semiconductor market leadership in the country. Through the ownership and operation of a semiconductor test center, Qualcomm Technologies will enhance its focus on customer service, continue to develop its expertise in operational excellence, and increase its business presence in China.

“The test facility is part of our continued mission to streamline supply chain operations and improve operational efficiency,” said Roawen Chen, senior vice president, QCT global operations, Qualcomm Technologies, Inc.

“Qualcomm Technologies continually strives to improve our manufacturing footprint in China and the formation of Qualcomm Communication Technologies in Shanghai is another example of this dedication,” said Frank Meng, chairman, Qualcomm China.

“We are excited to work with Qualcomm Technologies in their new test operation in China,” said Steve Kelley, Amkor’s president and chief executive officer. “Amkor offers the most advanced outsourced assembly and test technologies in China, and this expanded relationship is a natural extension of the long history of close collaboration between our two companies.”

The Shanghai-based facility is set to begin operations on October 18, 2016.

About Qualcomm Incorporated

Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its products and services businesses, including its semiconductor business, QCT. For more than 30 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.

About Amkor Technology, Inc.

Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operating base includes more than 8 million square feet of floor space, with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. For more information, visit www.amkor.com.

Related Press Releases

Press Releases

Qualcomm Announces Pricing of $11.0 Billion Senior Notes Offering

Qualcomm Incorporated (NASDAQ: QCOM) today announced it has priced a public offering of senior unsecured notes in a combined aggregate principal amount of $11.0 billion, consisting of:

  • $0.75 billion three-month LIBOR plus 0.36% Floating Rate Notes due 2019
  • $0.50 billion three-month LIBOR plus 0.45% Floating Rate Notes due 2020
  • $0.50 billion three-month LIBOR plus 0.73% Floating Rate Notes due 2023
  • $1.25 billion 1.85% Senior Notes due 2019
  • $1.50 billion 2.10% Senior Notes due 2020
  • $1.50 billion 2.60% Senior Notes due 2023
  • $1.50 billion 2.90% Senior Notes due 2024
  • $2.00 billion 3.25% Senior Notes due 2027
  • $1.50 billion 4.30% Senior Notes due 2047

Qualcomm intends to use the proceeds to fund a portion of the purchase price of Qualcomm’s planned acquisition of NXP Semiconductors N.V. and other related transactions as well as for general corporate purposes. The issuance of the notes is expected to close on or about May 26, 2017, subject to customary closing conditions.

Goldman Sachs & Co. LLC, J.P. Morgan Securities LLC, Merrill Lynch, Pierce, Fenner & Smith Incorporated, Barclays Capital Inc., Citigroup Global Markets Inc. and Deutsche Bank Securities Inc. are acting as joint book-running managers for the offering.

The offering is being made pursuant to an effective shelf registration statement filed with the Securities and Exchange Commission ("SEC"). The offering will be made only by means of a prospectus supplement relating to the offering and the accompanying base prospectus, copies of which may be obtained on the SEC website at http://www.sec.gov, or by contacting Goldman Sachs & Co. LLC by emailing prospectus-ny@ny.email.gs.com or calling toll-free at 1-866-471-2526;  J.P. Morgan Securities LLC, by calling collect at 212-834-4533; or Merrill Lynch, Pierce, Fenner & Smith Incorporated, by emailing dg.prospectus_requests@baml.com or calling toll-free 1-800-294-1322.

This press release shall not constitute an offer to sell or a solicitation of an offer to purchase any of these Notes, and shall not constitute an offer, solicitation or sale in any state or jurisdiction in which such an offer, solicitation or sale would be unlawful.

About Qualcomm

Qualcomm’s technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.

Note Regarding Forward-Looking Statements

In addition to the historical information contained herein, this press release contains forward-looking statements that are inherently subject to risks and uncertainties, including but not limited to statements regarding the note offering, including the use of proceeds from the offering and the expected closing date of the offering. Forward-looking statements are generally identified by words such as “estimates,” “guidance,” “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks” and similar expressions. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to risks that we may be unable to redeem any or all of the Special Mandatory Redemption Notes (as defined in the Preliminary Prospectus Supplement referenced below) in the event of the Special Mandatory Redemption (as defined in the Preliminary Prospectus Supplement referenced below); in the event of a Special Mandatory Redemption, holders of the Special Mandatory Redemption Notes may not obtain their expected return on such notes; the notes will be effectively junior to any secured indebtedness that we may incur in the future; we may incur additional indebtedness ranking equal to the notes; the notes will be effectively junior to any indebtedness and other liabilities of our subsidiaries; the notes do not have an established trading market, which may negatively affect their market value and a noteholder’s ability to transfer or sell their notes; ratings of the notes may change and affect the market prices and marketability of the notes; the amount of interest payable on the Floating Rate Notes (as defined in the Preliminary Prospectus Supplement referenced below) is set only once per period based on the three-month LIBOR rate on the interest determination date, which rate may fluctuate substantially; uncertainty relating to the LIBOR calculation process may adversely affect the value of the Floating Rate Notes; the financial information presented for Qualcomm and NXP Semiconductors N.V. (NXP) may not be fully comparable due to the different fiscal year-ends of each company; our proposed acquisition of NXP; commercial network deployments, expansions and upgrades of CDMA, OFDMA and other communications technologies, our customers’ and licensees’ sales of products and services based on these technologies and our customers’ demand for our products and services; competition in an environment of rapid technological change; our dependence on a small number of customers and licensees; our dependence on the premium-tier device segment; attacks on our licensing business model, including current and future legal proceedings or actions of governmental or quasi-governmental bodies or standards or industry organizations; potential requirements to change our patent licensing practices due to governmental investigations and/or private legal proceedings challenging those practices; government regulations and policies, or adverse rulings in enforcement or other proceedings; the enforcement and protection of our intellectual property rights; the commercial success of our new technologies, products and services, including our ability to extend our products into new and expanded product areas and adjacent industry segments; risks associated with operation and control of manufacturing facilities acquired through the formation of our joint venture, RF360 Holdings Singapore Pte. Ltd.; the continued and future success of our licensing programs and the need to extend license agreements that are expiring; our dependence on a limited number of third-party suppliers; claims by third parties that we infringe their intellectual property; strategic acquisitions, transactions and investments; our use of open source software; our stock price and earnings volatility; our indebtedness; foreign currency fluctuations; global regional or local economic conditions that impact the industries in which we operate; our ability to attract and retain qualified employees; failures in our products or services or in the products or services of our customers or licensees, including those resulting from security vulnerabilities, defects or errors; security breaches of our information technology systems; and potential tax liabilities. These and other risks are set forth in the Company’s Quarterly Report on Form 10-Q for the fiscal quarter ended March 26, 2017 and Preliminary Prospectus Supplement dated May 19, 2017 filed with the SEC. Our reports filed with the SEC are available on our website at www.qualcomm.com. We undertake no obligation to update, or continue to provide information with respect to, any forward-looking statement or risk factor, whether as a result of new information, future events or otherwise.

May 19, 2017
Press Releases

Qualcomm Demonstrates Dynamic Electric Vehicle Charging

Qualcomm Incorporated (NASDAQ: QCOM) through its subsidiary, Qualcomm Technologies, Inc., today demonstrated dynamic electric vehicle charging (DEVC), which allows vehicles to charge while driving. Based on the Qualcomm Halowireless electric vehicle charging technology (WEVC), Qualcomm Technologies designed and built a wireless DEVC system capable of charging an electric vehicle (EV) dynamically at up to 20 kilowatts at highway speeds. Qualcomm Technologies also demonstrated simultaneous charging, in which two vehicles on the same track can charge dynamically at the same time. The vehicles can pick up charge in both directions along the track, and in reverse, further showcasing how the Qualcomm Halo DEVC system has been designed to support real-world implementation of dynamic charging.

The dynamic charging demonstrations took place at the 100-meter FABRIC* test track, which has been built by VEDECOM at Satory Versailles. Qualcomm Technologies and VEDECOM integrated the source part of the Qualcomm Halo DEVC system in the test track, while VEDECOM and Renault integrated the receiving part onto two Renault Kangoo vehicles. Following today’s demonstration, the Qualcomm Halo DEVC system will be handed over to VEDECOM to perform tests for FABRIC. These tests will evaluate the operation, safety and efficiency of energy transfer to the vehicles for a wide range of practical scenarios including vehicle identification and authorization on entering track, power level agreement between track and vehicle, speed and alignment of vehicle along track.

FABRIC is a €9 million project, mostly funded by the European Commission, addressing the technological feasibility, economic viability, and socio-environmental sustainability of wireless DEVC. The project began in January 2014 and will continue through December 2017, and is being undertaken by a consortium of 25 organizations from nine European countries, including automotive manufacturers, suppliers, service providers and research organizations from automotive, road and energy infrastructure domains. VEDECOM is one of the FABRIC collaborators and responsible for providing the demonstration of the charging solution at Satory using the Qualcomm Halo DEVC system. FABRIC’s main goal is to conduct feasibility analysis of wireless DEVC as a means of EV range extension.

“Our engineers and management have fully supported this project since the very beginning as it aligns perfectly with our focus on EVs, charging systems and mobility services,” says Luc Marbach, chief executive officer, VEDECOM. “We are a public-private partnership focused on pre-competitive research. The installation of one of the world’s first DEVC test platforms has provided us with a unique test facility and we look forward to expanding our expertise with the future testing.”

“Being part of this exciting project has enabled us to test and further research dynamic charging on our Kangoo Z.E. vehicles,” said Eric Feunteun, electric vehicle program director, Groupe Renault. “Our engineers have worked very closely with the Qualcomm Technologies and VEDECOM teams to complete the DEVC system integration demonstration as part of FABRIC. We see dynamic charging as a great vision to further enhance the ease of use of EVs, thus the accessibility of EVs for all.”

“We are inventors. We are WEVC. This dynamic charging demonstration is the embodiment of this,” said Steve Pazol, vice president and general manager, wireless charging, Qualcomm Incorporated. “I am immensely proud of what we have achieved. The combination of a global team of expert engineers and Qualcomm Halo technology, which covers all aspects of WEVC systems, irrespective of the magnetics used, has enabled us to really push the boundaries of the possible and outline our vision for future urban mobility.”

About Qualcomm

Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.

May 18, 2017
Press Releases

Qualcomm and Google to Enable Daydream Standalone Virtual Reality Headsets

At Google I/O 2017, it was announced that Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ:QCOM), collaborated with Google to develop a Daydream standalone VR headset reference design powered by the Qualcomm® Snapdragon™ 835 VR platform. This advancement in Daydream builds on the earlier work Qualcomm Technologies and Google collaborated on to enable Daydream on smartphone devices.

“We are thrilled to once again work with Google and offer a powerful premium Snapdragon experience for devices on the Daydream platform,” said Keith Kressin, senior vice president, product management, Qualcomm Technologies, Inc. “Our companies share the same vision: to make it possible for everyone to enjoy rich and immersive VR experiences on a smartphone device or a dedicated VR head-mounted display while being fully mobile, rather than being restricted by cables or limited to predefined rooms setup for outside-in tracking.”

This is in addition to the Fall 2016 announcement of the Snapdragon 821 and 820 processors supporting Daydream-ready devices. The fruits of this multi-year effort with Google now offer customers choice in Daydream headsets - from smartphone VR to standalone VR.

“The Daydream standalone headset reference design created in close partnership with Qualcomm will enable manufacturers to build a whole new category of VR devices,” said Clay Bavor, vice president, virtual reality, Google. “These headsets have everything needed for VR, built right into the headset itself and are as easy to use as picking them up. They'll feature WorldSense for positional tracking right out of the box without any external equipment. We're thrilled that headsets will begin to hit shelves later this year.”

The new Daydream standalone headset reference design includes custom specifications for tracking cameras and other sensors that make the best use of the Tango-based tracking technology Google has placed in the headset. The first of these headsets are expected to hit shelves later this year.

About Qualcomm

Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio.  Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.

May 17, 2017
Press Releases

Qualcomm Files Breach of Contract Complaint against Apple’s Manufacturers for Non-Payment of Royalties

Qualcomm Incorporated (NASDAQ: QCOM) today filed a complaint in the United States District Court for the Southern District of California against FIH Mobile Ltd. and Hon Hai Precision Industry Co., Ltd., (together known as Foxconn), Pegatron Corporation, Wistron Corporation, and Compal Electronics, Inc., the four manufacturers of all Apple iPhones and iPads sold worldwide, for breaching their license agreements and other commitments with Qualcomm and refusing to pay for use of Qualcomm’s licensed technologies.  Qualcomm seeks an order that would require the defendants to comply with their long-standing contractual obligations to Qualcomm, as well as declaratory relief and damages.

 Despite a long history of consistently paying royalties under their license agreements with Qualcomm, the manufacturers now are refusing to pay royalties on the Apple products they produce.  While not disputing their contractual obligations to pay for the use of Qualcomm’s inventions, the manufacturers say they must follow Apple’s instructions not to pay. The license agreements with the manufacturers in many cases were entered into before Apple sold its first iPhone and Apple is not a party to the agreements.  Further, the defendants are continuing to pay Qualcomm royalties for use of Qualcomm’s technology in non-Apple products, under the very same agreements that apply to the Apple products.  Qualcomm has already filed a separate claim against Apple for its unlawful interference with the license agreements between Qualcomm and these manufacturers.

 “It is unfortunate that we must take this action against these long-time licensees to enforce our agreements, but we cannot allow these manufacturers and Apple to use our valuable intellectual property without paying the fair and reasonable royalties to which they have agreed,” said Don Rosenberg, executive vice president and general counsel of Qualcomm. “As Apple continues to collect billions of dollars from consumer sales of its Qualcomm-enabled products, it is using its market power as the wealthiest company in the world to try to coerce unfair and unreasonable license terms from Qualcomm in its global attack on the company. Our license agreements with Apple’s manufacturers remain valid and enforceable. The manufacturers must continue to live up to their obligations under these agreements and Apple should immediately cease its tortious interference.”

Press Release Resource

About Qualcomm

Qualcomm’s technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.

May 17, 2017
Press Releases

Qualcomm Snapdragon 660 and 630 Mobile Platforms Drive Advanced Photography, Enhanced Gaming, Integrated Connectivity and Machine Learning

Qualcomm Incorporated (NASDAQ: QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced two new mobile platforms, the Qualcomm® Snapdragon™ 660 and 630, both designed to support a leap in performance enabling advanced photography and enhanced gaming, in addition to long battery life and fast LTE speeds. The Snapdragon 660 and 630 Mobile Platforms include the Snapdragon 660 and 630 SoCs, which encompass the baseband functionalities, plus software and hardware components including RF front end, integrated Wi-Fi, power management, audio codec and speaker amplifier, all to support a comprehensive mobile solution.

“With the introduction of the Snapdragon 660 and 630 Mobile Platforms, we are thrilled that features such as improved image quality and fast LTE speeds will now be available in a wide array of devices without sacrificing performance or quality,” said Kedar Kondap, vice president, product management, Qualcomm Technologies, Inc. “This ensures that a greater number of consumers will be able to take advantage of higher quality user experiences in camera, audio and visual processing, connectivity, improved CPU and GPU performance, fast charging, security and machine learning.”

The Snapdragon 660 and 630 Mobile Platforms focus on seven categories of features:

  • Camera: The Qualcomm Spectra™ 160 premium camera ISP supports improved photographic image quality for more natural skin tones, superior low light photography, as well as better power efficiency and higher throughput for dual camera smartphones.  Also supported are features like smooth optical zoom, bokeh effects, dual pixel autofocus, and improved camcorder video stabilization;
  • Audio/Visual Processing: The Qualcomm® Hexagon™ 680 DSP featuring vector extensions (HVX) on the Snapdragon 660 Mobile Platform enables high performance, power efficient processing of imaging, computer vision, and machine intelligence workloads, another first in the 600 tier. Optimized software libraries include support for TensorFlow and Halide. Both platforms also support Qualcomm All-Ways Aware™ technology. This technology provides Qualcomm Technologies’ next generation of always-on contextual experiences and uses very low power running on the Hexagon DSP;
  • Connectivity: The Snapdragon 660 and 630 both feature a Snapdragon X12 LTE Modem, paired with the new SDR660 RF transceiver, which support peak downlink data rates of 600Mbps to the 600-tier lineup of SOCs for the first time. The Snapdragon 660 supports 2x2 MU-MIMO 802.11ac Wi-Fi for twice as much data throughput and up to 60 percent lower download power consumption as the Snapdragon 652. It also offers improved coverage, especially in homes, and offices with hard to penetrate brick and concrete walls as well as advanced features such as LTE/Wi-Fi antenna sharing, and Dual Band Simultaneous (DBS) operation. Both platforms also come with advanced RF front-end support including Qualcomm® TruSignal™ adaptive antenna tuning with carrier aggregation, designed to dynamically optimize signal quality in varying user conditions for wide network coverage and more consistent data and voice experience. The Snapdragon 660 and 630 are the first 600-tier chipsets with envelope tracking technology, including high-power user equipment (HPUE) support, for superior power efficiency and thermal performance. Both platforms also integrate powerful location engines with better sensitivity and support for new constellations (Galileo and QZSS) for faster location fix, enhancements to support mandatory emergency service requirements, as well as smoother pedestrian navigation with up to 50 – 75 percent lower power consumption (compared to previous generation). Both platforms also feature Bluetooth 5 support, which doubles the amount of data that devices can transfer compared to the previous iteration;
  • Improved CPU and GPU: The Snapdragon 660 Mobile Platform is the successor to the Snapdragon 653 and features a 20 percent improvement in the Qualcomm® Kryo™ 260 CPU and 30 percent improvement in the Qualcomm® Adreno™ 512 GPU performance, ensuring a better gaming and multimedia experience for end users. The Snapdragon 630, which succeeds the Snapdragon 625, offers a 30 percent increase in the Adreno 508 GPU performance over its predecessor, as well as a 10 percent increase in CPU performance over its predecessor. Both platforms are designed to offer excellent battery life;
  • Qualcomm® Quick Charge™ 4: The Snapdragon 660 and 630 Mobile Platforms feature the latest innovations in Quick Charge technology, which supports up to 5 hours of talk time in just 5 minutes of charging and up to 50 percent battery life in just 15 minutes of charging;
  • Security: Both platforms support Qualcomm® Mobile Security, which provides security focused hardware-based protection, user authentication and device attestation on the mobile device;
  • Machine Learning: OEMs and developers can also power immersive and engaging user experiences with machine learning on the Snapdragon 660 and 630 Mobile Platforms using the Snapdragon Neural Processing Engine SDK. This heterogeneous software framework offers support for Caffe/Caffe2 and TensorFlow, making it easy to target and run neural networks on the Snapdragon core that matches the power and performance profile of the desired feature – CPU, GPU or DSP/HVX.

The Snapdragon 660 and 630 Mobile Platforms share the same modem and camera architecture, and are pin and software compatible, making it simpler and easier for original equipment manufacturers (OEMs) to build, test and calibrate their devices. Both platforms use a 14nm FinFET process and provide 4K video capture and playback capabilities, along with 8GB maximum memory and Vulkan API support. Additionally, the Snapdragon 660 Mobile Platform supports displays up to QHD (2K) resolution, whereas the 630 supports FHD/QXGA (1080p).

To date, more than 1000 designs have launched or are in the pipeline across the Snapdragon 600 tier mobile platforms. The Snapdragon 660 Mobile Platform is now shipping and the Snapdragon 630 Mobile Platform will begin shipping towards the end of this month. Additional links below to our spec sheets and blog post: https://www.qualcomm.com/products/qualcomm-snapdragon-630-mobile-platform, https://www.qualcomm.com/products/qualcomm-snapdragon-660-mobile-platform,  

https://www.qualcomm.com/news/snapdragon/2017/05/08/snapdragon-660-and-630-mobile-platforms-high-end-features-more-devices

About Qualcomm

Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm’s website, blog, Twitter and Facebook pages.

May 9, 2017