Press Release

Qualcomm Announces Leadership Change and Appointment

Aug 28, 2011SEOUL

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (NASDAQ: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today announced that Dr. YK Cha will move from his role as senior vice president and president of Qualcomm Korea, to senior advisor to Jim Doh, senior vice president of worldwide sales and president of Qualcomm CDMA Technologies (QCT) Asia. As a result, Jim Doh has now been appointed to head up the combined Qualcomm Korea operations. Over the last two years, Dr. YK Cha has led Qualcomm Korea operations, providing strong leadership and greatly improving relationships with key stakeholders and partners in Korea.

Additionally, Te-Won Lee has been promoted to vice president of Qualcomm Korea and will lead the Qualcomm Korea office as a member of the Global Business Operations leadership team. He also will continue to lead R&D efforts in Korea as part of Corporate R&D and will report directly to Jim Doh.

“Qualcomm is very grateful for the invaluable guidance and service Dr. Cha has provided the Company, and we look forward to continuing to work with him to help us achieve even greater success in Korea,” said Jing Wang, executive vice president of Qualcomm and president of Global Business Operations. “We also are pleased to announce the promotion of Te-Won Lee to vice president of Qualcomm Korea. He has played an instrumental role in advancing R&D opportunities in Korea.”

Doh joined Qualcomm in 1997 and has held numerous leadership positions throughout his tenure. He helped to establish the QCT business in Korea, Taiwan and Japan, successfully growing the Company’s in-country presence and partnerships. Prior to joining Qualcomm, Doh held various technical and business management roles at Intel and Raytheon. He holds a bachelor’s in computer engineering from Boston University and a master’s in electrical engineering from Tufts University.

Lee joined Qualcomm in 2007, as part of its acquisition of SoftMax. Lee was a co-founder of SoftMax, a market leader of audio enhancement software and noise reduction solutions for Bluetooth headsets and mobile phone. He was previously a senior director of technology with QCT before joining the Corporate R&D team and moving to Seoul to establish the Korea Corporate R&D organization. His strong business acumen, engineering expertise and outstanding leadership skills makes him well positioned to lead Qualcomm’s Global Business Operations team in Korea. Lee holds a Ph.D. degree in electrical engineering from the University of Technology in Berlin, Germany.

About Qualcomm
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in 3G and next-generation mobile technologies. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other. Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere. For more information, visit Qualcomm around the Web:
Corporate Blog:


Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

©2022 Qualcomm Technologies, Inc. and/or its affiliated companies.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell any of the components or devices referenced herein.