— Qualcomm Incorporated (NASDAQ: QCOM) today introduced its newest Mobile Data Modem™ (MDM™) chipsets, the MDM9625™ and MDM9225™, for use in mobile broadband data devices. These new MDM chipsets will support the LTE FDD and LTE TDD UE Category 4 mobile broadband standards, which offer peak downlink data rates of up to 150 Mbps and will be fabricated using the 28nm technology node. The chipsets also are backwards compatible with previous generations of LTE and other wireless broadband standards, giving consumers using USB modems powered by the MDM9625 or MDM9225 chipsets an uninterrupted broadband data connection on nearly any network around the world. This announcement in combination with Qualcomm’s additional announcement today of the MDM8225™ chipset, which supports HSPA+ Release 9, are the latest examples of Qualcomm’s ongoing leadership in the development of new mobile broadband modem technologies.
The new chipsets will support LTE Category 4, offering up to 150 Mbps downlink data rates and 50 Mbps uplink data rates. Other standards supported by the MDM9625 chipset include HSPA+ Release 9, EV-DO Revision B, EV-DO Advanced and TD-SCDMA, while the MDM9225 chipset supports HSPA+ Release 9 and TD-SCDMA. In areas without LTE coverage, the chipsets will fall back on these other standards. The MDM9625 and MDM9225 chipset also support the latest Qualcomm Interference Cancellation & Equalization (Q-ICE) receiver, which reduces interference in a cellular network and increases network capacity to enhance the mobile broadband user experience. These chipsets are pin compatible, allowing OEMs to develop different tiers of products with low R&D costs.
“Demand for mobile data connectivity continues to grow among consumers, and operators are constantly striving to offer faster broadband technologies on their networks,” said Cristiano Amon, senior vice president of product management for Qualcomm. “Our MDM chipsets, like the MDM9625 and MDM9225, have been designed to support new mobile broadband standards while remaining compatible with previous ones, allowing consumers on-the-go access to their work or entertainment without the concern of network compatibility.”
The MDM9625 and MDM9225 chipsets can be used with Qualcomm’s WTR1605 radio frequency IC and PM8018 power management ICs to create a highly-integrated mobile broadband solution. Samples of the MDM9625 and MDM9225 chipsets are anticipated to be available in Q4 2011.
Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G and next-generation mobile technologies. For 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other. Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere. For more information, visit Qualcomm around the Web:
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Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of MDM9625 and MDM9225 chipsets on a timely and profitable basis, the extent and speed to which networks utilizing the LTE FDD and LTE TDD UE Category 4 mobile broadband standards are deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 26, 2010, and most recent Form 10-Q.