Feb 14, 2011BARCELONA, Spain
Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm Incorporated (NASDAQ: QCOM) today introduced its newest Mobile Data Modem™ (MDM™) chipset for use in mobile broadband data devices, the MDM8225™. This new MDM will support HSPA+ Release 9, the latest version of the popular mobile broadband standard, which incorporates technology enhancements that help the chipset deliver data rates of up to 84 Mbps on the downlink. The MDM8225 will be fabricated using the 28nm technology node.
“Dual-carrier HSPA+ has proven to be a popular standard with mobile network operators who are now looking to improve their wireless networks’ performance by adopting the latest version of the technology,” said Cristiano Amon, senior vice president of product management for Qualcomm. “Qualcomm’s new chipset will allow device OEMs to develop high-performance, low-power and small-form factor devices, such as USB modems or portable WiFi hotspots that take advantage of the higher data rates provided by HSPA+ Release 9. We are excited to be working with T-Mobile USA to deliver 84 Mbps HSPA+ capability in 2012 with the MDM8225.”
“Qualcomm is one of T-Mobile’s key strategic partners that supports our ongoing drive to take the HSPA+ ecosystem to 84 Mbps and beyond,” said Neville Ray, chief technology officer, T-Mobile USA. “We look forward to continuing to work with Qualcomm to stay at the forefront of wireless innovation with new and compelling 4G devices and services.”
The new chipsets will support HSPA+ MIMO antenna technology simultaneously with HSDPA carrier aggregation on the downlink to deliver higher data rates to users. The dual-carrier HSDPA feature will also support aggregation of carriers from different frequency bands and will give network operators greater flexibility in the use of their allocated radio spectrum to deliver doubled data rates for faster mobile broadband connectivity. Additionally, MDM8225 will support dual-carrier HSUPA operation to double uplink user data rates. The MDM8225 chipsets will support the latest Qualcomm Interference Cancellation & Equalization (Q-ICE) receiver, a feature that removes interference in a cellular network to increase network capacity and enhance the mobile broadband user experience.
The new chipsets will integrate a dedicated processor that will allow OEMs to develop new product classes and services at a lower cost. For example, OEMs will be able to develop WiFi hotspot products without requiring an external application processor. The MDM8225 will pair up with the WTR1605 radio frequency IC and PM8018 power management IC to provide a highly integrated chipset solution.
The MDM8225 chipset will support all major 3GPP radio bands, including the 1800 MHz band. As operators plan to refarm their 1800 MHz spectrum to provide for additional data capacity, the MDM8225 will add to Qualcomm’s family chipsets that will support HSPA+ in the 1800 MHz band.
Samples of the MDM8225 are anticipated to be available in Q4 2011.
Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G and next-generation mobile technologies. For 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other. Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere. For more information, visit Qualcomm around the Web:
Corporate Blog: www.qualcomm.com/blog
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of MSM8225 on a timely and profitable basis, the extent and speed to which HSPA+ Release 9 is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 26, 2010, and most recent Form 10-Q.