Jun 29, 2010SAN DIEGO
Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
SAN DIEGO — June 29, 2010 — Qualcomm Incorporated (NASDAQ: QCOM) today announced that five companies have begun developing products based on Qualcomm’s expanded portfolio of 3G/4G solutions with a common Gobi™ application programming interface (API). Huawei, Novatel, Option, Sierra Wireless and ZTE are now developing mobile connectivity products — including embedded modules and USB modems — using the latest Gobi-enabled MDM chipsets with Qualcomm’s new Gobi API. These new connectivity solutions will be beneficial in bringing mobile connectivity to new categories of devices.
“To meet consumer demand for transparent connectivity on a wide range of devices, it is vital that device manufacturers be able to easily integrate 3G/4G technology into their products,” said Barry Matsumori, vice president of product management for Qualcomm CDMA Technologies. “We are very excited to see leading manufacturers begin developing products based on our expanded Gobi chipset and API technology portfolio.”
In addition to broad adoption among original equipment manufacturers, Qualcomm’s Gobi technology has also won support from leading mobile network operators.
“There is a huge industry opportunity in connectivity beyond the mobile handset, and we have already made significant inroads into offering consumers PCs with embedded connectivity, as well as USB modems and other devices that leverage the cellular network,” said Luis Ezcurra, director of devices at Telefonica Spain. “Qualcomm’s Gobi technology has become the flagship solution for transparent wireless connectivity, and their new common software interface approach will deliver significant efficiencies to our business and ultimately greater benefits to our subscribers.”
Announced earlier this year, Qualcomm’s latest Gobi-enabled MDM chipsets feature the new Gobi API and are compatible with leading mobile connectivity standards, including CDMA2000® 1xEV-DO Rev. A and Rev. B, HSPA+, dual-carrier HSPA+, and LTE with integrated backwards compatibility to HSPA and EV-DO. For more information about Gobi technology, please visit www.gobianywhere.com.
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in next-generation mobile technologies. For 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other. Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere. For more information, visit Qualcomm around the Web:
Corporate Blog: www.qualcomm.com/blog
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of ASIC components on a timely and profitable basis, the timely and successful development by device manufactures of mobile connectivity products using the latest Gobi-enabled MDM chipsets with the Company’s new Gobi API, sufficient and timely demand for such mobile connectivity products, the development of new categories of devices utilizing mobile connectivity, continued growing support of Gobi technology from leading mobile network operators, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 27, 2009, and most recent Form 10-Q.