Mar 23, 2010SAN DIEGO
Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of wireless technologies, products and services, today unveiled an expanded product roadmap for its Gobi™ connectivity technologies as part of the Company’s expanded focus on targeting new markets with Gobi connectivity. The latest modem chipsets that have been added to the Gobi product family deliver support for CDMA2000® 1xEV-DO Rev. A and Rev. B, HSPA+, dual-carrier HSPA+ and LTE with integrated backwards compatibility to HSPA and EV-DO. Building on the success of Gobi technology in PC markets as an embedded module, Qualcomm is now prepared to serve the needs of additional market segments, including USB modems, e-readers, gaming devices and M2M commercial applications.
Qualcomm’s Gobi solutions include software enhancements for select MDM chipsets that will enable a common Gobi software interface (API) across multiple hardware platforms. This interface will help streamline integration efforts, spur application development among third-party developers and deliver greater flexibility to device manufacturers. The following data chipsets are now available with the Gobi API:
- MDM6200™: supports HSPA+ data rates of up to 14.4 Mbps
- MDM6600™: supports HSPA+ data rates of up to 14.4 Mbps and CDMA2000® 1xEV-DO Rev. A/Rev. B
- MDM8200A™: supports HSPA+ data rates of up to 28 Mbps
- MDM8220™: supports dual-carrier HSPA+ for data rates of up to 42 Mbps
- MDM9200™: supports LTE data rates of up to 100 Mbps with full backward compatibility to dual carrier HSPA+
- MDM9600™: supports LTE data rates of up to 100 Mbps with full backward compatibility to dual carrier HSPA+ and EV-DO Rev. A/Rev. B
“For the mobile user, Gobi in a Dell laptop or netbook has become synonymous with simple, reliable access to various mobile broadband networks regardless of where their travels take them,” said John Thode, Dell’s vice president, small screen devices. “With Qualcomm’s commitment to expand the Gobi program to support the latest 3G and coming 4G networks, Dell mobile devices with built-in Gobi wireless technology will deliver the best anywhere, anytime connectivity solution for digital nomads around the world.”
“Our Gobi technology is bringing the transparent, reliable and widely available connectivity of 3G to notebooks, netbooks, e-readers, routers and other market segments that are benefiting from access to mobile broadband,” said Barry Matsumori, vice president of product management for Qualcomm CDMA Technologies. “With this newly expanded roadmap, Gobi- enabled devices can bring greater value to consumers and enterprises than ever before.”
At International CTIA Wireless 2010, the Company will be showcasing collaboration with Absolute Software, Anomalous Networks, Fiberlink, iPass, Microsoft, Top Global and Trellia on Gobi technology at its booth #2439 in Central Hall 4.
For more information about Gobi technology, please visit www.gobianywhere.com.
Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2008 FORTUNE 500 company. For more information, please visit www.qualcomm.com.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of modem chipsets on a timely and profitable basis, the extent and speed to which CDMA and other wireless connectivity technologies are deployed, the extent and speed to which the Gobi product family is commercially available and adopted, the extent and speed to which additional market segments develop for the Gobi solution, the timely and successful development of enabling software enhancements for select MDM chipsets, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 27, 2009, and most recent Form 10-Q.