Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today unveiled a new family of chipset solutions that expand its HSPA+ product portfolio. The new HSPA+ products, which include solutions for mobile handsets and data cards, will enable an enhanced user experience by combining support for advanced mobile broadband technologies with powerful processing and multimedia capabilities. The family of products also includes a new Qualcomm transceiver-the QTR8610™-which supports worldwide 3G bands and integrates Bluetooth, GPS, FM radio, and necessary codecs to deliver a high level of functionality in a single chip.
“As HSPA+ becomes an increasingly popular option for network operators looking to maximize their investments in 3G networks, Qualcomm has expanded its HSPA+ product roadmap to now include a comprehensive family of chipsets covering multiple tiers of the wireless market,” said Alex Katouzian, vice president of product management for Qualcomm CDMA Technologies. “The advanced connectivity, multimedia and processing capabilities of our chipsets are enabling the next-generation mobile user experience.”
The new HSPA+ chipsets include the Mobile Station Modem™ (MSM™) MSM8260™, MSM8660™ and MSM8270™ solutions for mobile handsets, as well as the Mobile Data Modem™ (MDM™) MDM8220™ for data applications.
The MSM8260, MSM8660 and MSM8270 solutions for mobile handsets deliver a new level of mobile multimedia performance, including:
· Scorpion 1.2 GHz processor and 600 MHz DSP for high levels of web application and multimedia performance
· Support for innovative 3D/2D user interfaces and console-quality gaming via dedicated, high-performance graphics engines
· 16 megapixel camera
· Full 1080p HD video playback and recording
· Support for DTS/Dolby 5.1 surround sound
· Integrated Assisted-GPS, including support for Glonass satellite services
· Support for stunning 24-bit WXGA (1280 x 800) displays
· 45nm process technology for ultra-low power consumption
The MSM8260 supports 3GPP Release 7 HSPA+ for data rates of up to 28 Mbps. The MSM8660 adds support for 3GPP/3GPP2 multimode, and the MSM8270 adds support for Release 8 dual-carrier HSPA+ for even higher data rates of up to 42 Mbps. All three products offer full backward compatibility to previous generation networks and are pin-, software- and functionally-compatible.
The MDM8220 solution for data cards features support for 3GPP Release 8 standard, dual-carrier HSPA+ for up to 42 Mbps on the downlink and 11 Mbps on the uplink. By aggregating two HSPA carriers in parallel, Release 8 HSPA+ dual-carrier technology effectively doubles the end user's bandwidth from 5 MHz to 10 MHz to enhance Web 2.0 experiences.
The new QTR8610 transceiver, which integrates support for all worldwide 3G bands and eliminates the need for standalone codecs, GPS, Bluetooth and FM radio chips, is compatible with the MSM8660, MSM8260 and MSM8270 chipsets.
Anticipated sampling schedules:
|MSM8260 and MSM8660|
|Fourth quarter of 2009|
|Fourth quarter of 2009|
Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2008 FORTUNE 500® company. For more information, please visit www.qualcomm.com.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully manufacture significant quantities of the MDM8220, MSM8260, MSM8660, MSM8270 and QTR8610 on a timely and profitable basis, the commercial deployment of HSPA+ networks, the extent and speed to which WCDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2008, and most recent Form 10-Q.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 2008, and most recent Form 10-Q.