Feb 11, 2009SAN DIEGO
Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today introduced its second-generation embedded Gobi™ module, delivering multi-mode 3G mobile Internet access on either HSPA or CDMA2000® EV-DO networks in markets around the world. The Gobi2000™ module offers a wide range of enhancements, including support for additional radio frequencies, increased data speeds, enhanced GPS functionality and support for additional operating systems such as Windows 7. Currently sampling, the Gobi2000 module is expected to be in laptops scheduled for commercial launch in the second half of 2009.
“Qualcomm's first-generation Gobi module has been broadly accepted as seven of the world's 10 largest notebook OEMs have adopted Gobi, and we are now expanding our Gobi roadmap with a second-generation product that delivers enhanced functionality in response to industry demands,” said Mike Concannon, senior vice president of product management for Qualcomm CDMA Technologies. “The Gobi2000 module offers a broad range of performance enhancements that will further accelerate the market growth of embedded 3G connectivity.”
The Gobi2000 module adds support for additional radio frequencies within the 800 MHz and 900 MHz bands, including UMTS900 which is often used for rural areas in Europe. Improved uplink capabilities, with support for up to 5.76 Mbps via HSUPA, translates to even faster upload speeds for laptops equipped with Gobi2000 technology. The GPS functionality of the Gobi2000 module has been further improved with support for Assisted-GPS (A-GPS) and gpsOneXTRA™ Assistance Technology, which delivers enhanced operation for standalone-GPS via assistance data when A-GPS is not available. Gobi2000 technology supports an expanded range of operating systems, including integration with Windows 7, to enable an optimal 3G connectivity experience.
“Microsoft sees embedded 3G connectivity becoming an increasingly standard feature in mobile computing, and we believe that Gobi2000 will help drive the exponential growth of the market,” said Gary S. Greenbaum, director of business development for Windows Networking at Microsoft Corp. “We believe Gobi notebook and netbook customers will experience the long-sought desire for ubiquitous connectivity.”
“The Gobi module delivers significant benefits not only to notebook users seeking flexibility in connectivity, but also to the entire industry,” said Carol Hess-Nickels, director, worldwide business notebook marketing, Personal Systems Group, HP. “HP has implemented first-generation Gobi into multiple notebook models across our portfolio, and we are looking forward to leveraging the enhancements in Gobi2000 in future notebook offerings.”
The Gobi2000 solution includes Qualcomm's MDM2000™ chipset, associated HMA-compliant software* and APIs, and a reference design for a software-defined configurable data modem supporting EV-DO Rev. A and HSPA - with full backward compatibility.
Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2008 FORTUNE 500® company. For more information, please visit www.qualcomm.com.
*Nothing in this press release is an offer to sell any of the parts referenced herein. This press release may reference and/or show images of parts and/or devices utilizing parts whose manufacture, use, sale, offer for sale, or importation into the United States are subject to certain injunctions against Qualcomm. This press release is intended solely to provide information for those products and uses of products that are outside the scope of the injunctions. Any device utilizing 1x-EVDO parts must utilize Qualcomm's hybrid mode alternative (HMA) solution.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the Company's ability to successfully design and have manufactured significant quantities of the Gobi2000 module on a timely and profitable basis, the extent and speed to which HSPA and CDMA2000 EV-DO networks are deployed in markets around the world, the demand for embedded 3G connectivity in notebooks and netbooks, the extent to which notebook and netbook manufacturers incorporate 3G connectivity in such products and the pace of such product introductions, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 2008, and most recent Form 10-Q.