Press Release

Qualcomm Introduces Complete Solution for Ultra Mobile Broadband

Company’s Roadmap Now Offers Base Station Solution and Device Chipsets for Ultra Mobile Broadband to Start Sampling in First Quarter 2008

27 Mar 2007ORLANDO, Fla.

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced the addition of an end-to-end solution for Ultra Mobile Broadband™ (UMB™) to its roadmap. Qualcomm's next-generation Cell Site Modem™ (CSM™) CSM8900™ and Mobile Data Modem™ (MDM™) MDM8900™ modem chip solutions will support the latest 3GPP2 UMB standard, expected to be finalized within the first half of this year. UMB technology incorporates the benefits of OFDMA, CDMA and other air interface techniques with MIMO and advanced antenna technologies to offer features such as support for broadband speeds, greater capacity and coverage, and an enhanced user experience for future mobile services. Qualcomm will present the industry's first over-the-air UMB demonstration in the Company's booth, #1645, at the CTIA Wireless 2007 conference in Orlando, Fla.

“Qualcomm's commitment to driving the adoption of the newest technologies by offering the most advanced products and working closely with industry leaders remains unchanged for UMB,” said Dr. Sanjay K. Jha, chief operating officer of Qualcomm and president of Qualcomm CDMA Technologies. “The growing base of subscribers that demand increasingly advanced services will expect the performance and new possibilities that UMB will deliver by 2009.”

The MDM8900 modem solution, which will provide support for up to 40 Mbps on the downlink and 10 Mbps on the uplink, will interface with the Mobile Station Modem™ (MSM™) MSM7850™ to offer a complete mobile device solution that takes advantage of new services enabled by UMB. The CSM8900 cell site solution features a new single-sector architecture and leverages Qualcomm's Snapdragon™ technology for unsurpassed mobile broadband performance. The CSM8900 also supports 4x4 MIMO and serial input/output to help drive the deployment of next-generation wireless capabilities. Sampling of the MDM8900 is scheduled for the first quarter of 2008, and sampling of the CSM8900 is scheduled for the second quarter of 2008.

UMB is an evolutionary upgrade within the family of CDMA2000® standards that can be deployed in existing or new spectrum allocations using scalable bandwidths up to 20 MHz. Network operators can benefit from the new revenue opportunities and greater margins for mobile broadband services made possible with greater bandwidth, spectrum and band options, as well as the network scalability and flexibility that UMB offers. Wireless users will experience an enhanced mobile broadband experience with a wide range of interactive services.

Qualcomm's live UMB booth demonstrations at CTIA Wireless 2007 will feature a variety of QoS-enabled applications running simultaneously, including high-definition video streaming, high-quality video conferencing and voice over IP, illustrating UMB's capabilities for delivering a similar multimedia experience across different devices and services. The demonstration will be the first of many reflecting the introduction of UMB for testing and trials.

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2006 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of UMB components on a timely and profitable basis, the timing of UMB standard finalization, the extent and speed to which UMB is commercially deployed, the timing of MDM8900 and CSM8900 chip sampling, customer adoption of the MDM8900 and CSM8900, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 2006, and most recent Form 10-Q.
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