Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced a new chipset solution designed to expand mobile broadband Smartphones beyond the enterprise segment into mainstream consumer markets. Qualcomm's Mobile Station Modem™ (MSM™) MSM7225™ chipset is designed to make the smartphone more affordable and available to an increasing number of subscribers by enabling sub-$200 mobile broadband Smartphones. The MSM7225 chipset features a dual-processor architecture for third-party operating system support and high-speed HSDPA and HSUPA data modems. Sampling is scheduled for the third quarter of 2007 with devices based on this solution expected to be in production by the first quarter of 2008.
“Qualcomm's new MSM7225 chipset will enable devices that extend the desktop experience to mobile devices at very affordable price points,” said Dr. Sanjay K. Jha, chief operating officer, Qualcomm and president of Qualcomm CDMA Technologies. “Together with the wide availability of mobile broadband networks around the world, our third-generation HSUPA chipset will change the dynamics of the Smartphone market and allow more users around the world to enjoy increased productivity.”
The MSM7225 chipset, which leverages significant hardware and software design innovations from the industry's first HSUPA solutions - Qualcomm's MSM7200™ and MSM7200A™ chipsets - will play an instrumental role in accelerating the momentum behind the deployment of HSUPA. The chipset will help proliferate a wide range of new services such as video sharing, photo sharing, VoIP and real-time gaming with a wide range of hardware and software capabilities:
- Support for today's most popular third-party operating systems including Windows Mobile® and Linux
- UMTS Release 6 modem features including 7.2 Mbps HSDPA, 5.76 Mbps HSUPA and Multimedia Broadcast Multicast Service (MBMS)
- Rich multimedia, including 5.0 megapixel camera, 30fps WQVGA video recording and playback and compatibility with a wide range of audio/video codecs
- Direct broadcast support for MediaFLO, DVB-H and ISDB-T Integrated Assisted- and Standalone-GPS
- Integration of a wide range of peripheral features, such as High-Speed USB, Bluetooth™ 2.0, WiFi and VGA display panels, with multiple SDIO ports
The MSM7225 solution features an 12mm x 12mm package size for slimmer form-factors. The future availability of a package-on-package (PoP) stacked memory option will further reduce the size and thickness of Smartphones based on the MSM7225 chipset.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2006 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed of adoption by device manufacturers of the MSM7225 chipset, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 2006, and most recent Form 10-Q.