Solutions Integrate Baseband, RF and Power Management Functions to Reduce Cost, Power Consumption and SizeSAN DIEGO
Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced an expansion to its Qualcomm Single Chip™ (QSC™) family to include support for UMTS. The new QSC6240™ product for WEDGE (WCDMA and GSM/GPRS/EDGE) and QSC6270™ product for HEDGE (HSDPA/WCDMA and GSM/GPRS/EDGE) are the world's first solutions to integrate a monolithic die - with integrated radio transceiver, baseband modem and multimedia processor - together with power management functionality into a single chip for WCDMA (UMTS) and HSDPA handsets. The cost and time-to-market advantages of the single-chip solutions will help drive wireless broadband and 3G adoption in mass markets around the world.
“By introducing our fourth generation of single-chip solutions that include WCDMA/EDGE and HSDPA/EDGE, Qualcomm is making the high-speed data and rich multimedia capabilities of 3G technologies accessible to a much wider base of wireless users around the world,” said Dr. Sanjay K. Jha, president of Qualcomm CDMA Technologies. “Qualcomm is leveraging its technology leadership in 3G and single-chip design to significantly drive down the cost of 3G handsets and considerably reduce time to market by offering the world's first single-chip WCDMA and HSDPA solutions.”
The high levels of integration in the QSC6240 and QSC6270 solutions significantly reduce bill-of-materials costs and discrete components, delivering board-area savings of up to 50 percent. The two solutions leverage cost-efficient 65nm CMOS process technology and significantly improve power efficiency for longer talk/standby times and an enhanced multimedia user experience. The two solutions feature:
- Complete chipset solution in a 12mm x 12mm package
- Up to 3 megapixel camera support
- Support for WCDMA (UMTS) in one of 800/850/900MHz, and two of 1700/1800/1900/2100 MHz bands, as well as quad-band GSM/GPRS/EDGE
- 72-voice simultaneous polyphonic ringtones
- Integrated USB 2.0 high speed
- Advanced codecs, including eAAC+, H.264, Real® and Windows Media®
- 15fps video encode and decode capability
- Support for OpenGL® ES 1.0 3D graphics capability
Sampling of the QSC6240 and QSC6270 solutions is scheduled for the third quarter of 2007.
For further information about Qualcomm's QSC products, visit www.cdmatech.com/singlechip.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2006 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Qualcomm is a registered trademark of Qualcomm Incorporated. Qualcomm Single Chip, QSC, QSC6240 and QSC6270 are trademarks of Qualcomm Incorporated. OpenGL is a trademark or registered trademark of Silicon Graphics, Inc. in the United States and/or other countries worldwide. Real is a trademark or registered trademark of RealNetworks, Inc. Windows Media is a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries. All other trademarks are the property of their respective owners.
November 13, 2006
November 13, 2006Qualcomm Introduces Industry’s First Single-Chip UMTS and HSDPA SolutionsQualcomm Introduces Industry’s First Single-Chip UMTS and HSDPA Solutions