Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced the radioOne™ RFR6275™ diversity receive chip to increase network capacity and deliver higher speed data rates for High Speed Downlink Packet Access (HSDPA). The RFR6275 extends the functionality of the RTR6275™ transceiver device, also announced today, to include support for HSDPA receive diversity and Assisted-GPS (A-GPS). Samples of the RFR6275 are expected to ship in the second quarter of 2005.
This complete solution for HSDPA receive diversity includes the RFR6275 receive device, the RTR6275 transceiver, the MSM6275™ Mobile Station Modem™ (MSM™) chipset and the PM6650™ powerOne™ power management device. This solution provides support for WCDMA (UMTS) and HSDPA receive diversity at 1800 or 1900 or 2100 MHz.
The RFR6275 receiver uses RF CMOS (Complementary Metal Oxide Semiconductor), a low-cost, high-volume digital process technology used for a majority of today's digital computer microchips. The RFR6275 supports HSDPA receive diversity, which uses an additional antenna and associated receive chain to provide improved signal reception, enabling higher data throughput and significant increases in network capacity, especially in dense urban environments. This allows the RFR6275 to enable up to 5 dB receive diversity gain. This device also integrates a GPS receiver, which supports Qualcomm's gpsOne™ solution, the world's most broadly deployed assisted-GPS handset technology. The RFR6275 device is offered in a 6mm x 6mm, 40-pin Quad Flat No-Lead (40QFN) package.
The MSM6275 chipset delivers peak data rates of 1.8 Mbps and provides support for EDGE and HSDPA, a next-generation WCDMA (UMTS) technology.
Qualcomm's radioOne Zero Intermediate Frequency (ZIF) architecture eliminates the need for Intermediate Frequency (IF) components. With the radioOne technology, Qualcomm's MSM chipsets require less printed-circuit-board area than previous generations and reduce time-to-market development and bill-of-materials (BOM) costs.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2003 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 2003, and most recent Form 10-Q.