Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced a fully integrated radioOne™ Zero Intermediate Frequency (ZIF) solution for CDMA2000® 1X and 1xEV-DO in the Korean PCS (1800 MHz), PCS (1900 MHz) and IMT (2100 MHz) frequency bands. Qualcomm's latest radioOne chip, the RFR6135™ receive RF chip, works with Qualcomm's RFT6100™ transmit chip to provide a dedicated RF solution that allows wireless manufacturers to optimize their handset designs to address high-band market requirements. This cost-competitive solution increases design options for wireless manufacturers by providing maximum flexibility in component selection and inventory management.
The initial product offering will include the MSM6500™ Mobile Station Modem™ (MSM™) chipset and system software, the RFR6135 and the RFT6100 RF devices and Qualcomm's powerOne™ PM6650™ power management device chipset. The complete MSM6500 system solution will provide dedicated high-band capability including mode support for CDMA2000 and Qualcomm's gpsOne™ solution, the world's most broadly deployed assisted-GPS handset technology. Qualcomm's newest radioOne device, the RFR6135 chip, is a cost-effective RF receive solution that integrates a GPS receiver, low-noise amplifiers (LNA), and a voltage controlled oscillator (VCO) and phase locked loop (PLL) for further space-saving advantages and simplification of the radio design. The RFR6135 and RFT6100 RF devices provide a dedicated high-band, dual mode solution that reduces board area by optimizing package size. The RFR6135 chip is offered in a 7mm x 7mm, 48-pin Quad Flat No-Lead (48QFN) package. Samples of the RFR6135 are expected to ship in the second calendar quarter of 2004.
Qualcomm's radioOne ZIF architecture eliminates the need for intermediate frequency components. With radioOne technology, Qualcomm's MSM chipsets require less printed-circuit-board area than previous generations and reduce time-to-market development and bill-of-materials (BOM) costs.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2003 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 2003, and most recent Form 10-Q.