Press Release

Qualcomm's MSM6250 Chipset Selected by Hisense Group Co., Ltd. for the WCDMA (UMTS)/GSM/GPRS Market

2004年2月23日CANNES, France

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology and Hisense Group Co., Ltd., today announced the selection of Qualcomm's MSM6250™ Mobile Station Modem™ (MSM™) chipset and system software for Hisense's multimode third-generation (3G) handsets. With the MSM6250 chipset, Hisense will provide cost-effective, feature-rich multimedia-enabled handsets to WCDMA (UMTS) markets using a proven solution for faster time to market.

"Hisense is dedicated to providing consumers with high-quality 3G handsets and devices," said Liu Guodong, vice president of Hisense Group Co., Ltd. "By integrating Qualcomm's MSM6250 chipset into our data-enabled devices, we will be able to develop a broad product offering that further promotes WCDMA (UMTS) expansion throughout China."

"Qualcomm's fully integrated MSM6250 chipset will enable Hisense to provide comprehensive, data-enabled devices to China's expanding WCDMA (UMTS) marketplace," said Luis Pineda, vice president of marketing and product management for Qualcomm CDMA Technologies. "The combination of Qualcomm and Hisense technologies will give consumers in China's WCDMA (UMTS) market access to affordable, robust multimedia devices."

Qualcomm's MSM6250 chipset solution helps enable worldwide roaming for WCDMA (UMTS) terminals. The MSM6250 system solution supports dual-mode, quad-band GSM transceiver operations [GSM 850, GSM 900, Digital Cellular System (DCS) 1800, and GSM 1900] and WCDMA (UMTS) transmit operations for 800 MHz, 1900 MHz and 2100 MHz. Now, with minimal board design modifications, operators can offer a single device that can roam anywhere in the world.

Building upon Qualcomm's previous WCDMA (UMTS) solutions, the MSM6250 chipset includes the fully integrated multimedia features of the Launchpad™ suite of applications. This single-chip solution eliminates the need for an external applications processor and associated memory, significantly reducing bill-of-material (BOM) costs, board size and power consumption.

The MSM6250 solution supports the advanced feature set of Qualcomm's Launchpad suite of technologies, including MPEG-4 video encoding/decoding, JPEG encoding/decoding, MP3/AAC audio decoding, a 2D/3D graphics accelerator for advanced gaming applications, a high polyphony MIDI synthesizer and a digital camera interface that supports up to 2-megapixel resolution. The MSM6250 solution also integrates gpsOne™ functionality, featuring SnapTrack® enhancements to support assisted and standalone GPS, enabling a wide variety of location-based services and applications, including points of interest, personal navigation and friend finder. Also integrated into this solution are Bluetooth® wireless connectivity and USB On-The-Go (OTG) host controller to communicate directly with printers, digital cameras, keyboards and other accessories.

As with all members of the MSM6xxx family of chipset solutions, the MSM6250 solution features Qualcomm's radioOne™ Zero Intermediate Frequency (ZIF) architecture, which eliminates the need for Intermediate Frequency (IF) components. With radioOne technology, the MSM6250 chipset requires less printed-circuit-board area than previous generations and reduces time-to-market development and BOM costs.

The MSM6250 solution includes access to Qualcomm's BREW™ solution. Qualcomm's BREW solution enables the development of applications, the customization of devices with advanced content including Java Virtual Machines (JVMs), multimedia messaging services (MMS), Web browsers and user interfaces (UI), allowing operators and OEMs to differentiate their products and services to increase revenues. The MSM6250 chipset is also compatible with the Java® runtime environment; the J2ME™ solution can be built entirely on the MSM6250 chipset as an extension to the BREW solution.

Hisense Group Co., Ltd. is the largest professional telecommunications enterprise in East China's Shandong Province. Founded 30 years ago as a small workshop enterprise, Hisense Group has since developed into an integrated business with commercial interests spanning household appliances, telecommunications, information technology, international trade and real estate.

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and is a 2003 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 2003, and most recent Form 10-Q.

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