SAN DIEGO -- May 22, 2003 -- Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced a new generation of powerful dual-Central Processing Unit (CPU) single chip solutions - the 7xxx family - to address the growing need for more cost-effective, high-performance solutions that drive full-featured third-generation (3G) multimedia handsets for consumers and high data rate devices for enterprise customers. In designing the MSM7xxx family, Qualcomm has brought together its core strengths in wireless chipset design; modem, CPU and Digital Signal Processor (DSP) expertise; system software and highly integrated applications engines for future 3G wireless products.
Samples of chipsets in this series are expected to ship in 2004.
"The 7xxx series addresses the growing consumer demand for higher-performance wireless devices delivering high-quality audio-visual and 2D/3D gaming, as well as the emerging wireless enterprise data market," said Sanjay Jha, president of Qualcomm CDMA Technologies. "This new family of complete solutions ensures reduced design and development times, stimulating a greater number of affordable, high-end devices to spur mass-market adoption of wireless data services."
Each MSM7xxx chip incorporates a dual-CPU architecture with one processor optimized for multimode modems and time-critical functions, and the second available as a closely-coupled general purpose processor. The various multimode chipsets in the MSM7xxx family support deployed 3G wireless standards, including CDMA2000® 1X/1xEV-DO and WCDMA (UMTS) modes, and are fully compatible with GPRS, GSM and IS-95 standards. New modem technologies supported by this series are CDMA2000 Revision D, High-Speed Downlink Packet Access (HSDPA), 802.11 and integrated GPS.
The MSM7xxx family provides the most effective system solution for full-function CDMA terminals, providing superior optimization of power, cost and performance. This highly integrated new architecture enables design of higher performance wireless handsets for mainstream acceptance, while at the same time keeping overall cost and power requirements to a minimum.
In each MSM7xxx solution, the general purpose processor supports the high-performance multimedia application engines that run on high-resolution displays and easily integrates with Qualcomm's Binary Runtime Environment for Wireless™ (BREW™) application environment and third party operating systems. With the BREW routines, protocols and tools, handset manufacturers and developers can create embedded wireless applications and BREW-based products more quickly and easily.
As with the MSM6xxx family, this new generation of chipset solutions also supports Qualcomm's radioOne™ Zero Intermediate Frequency (ZIF) architecture, providing reduced bill of materials and more cost-effective solutions for multimode, multiband 3G wireless devices.
Key features of the MSM7xxx series of complete solutions include:
- An integrated applications processor featuring an ARM11, delivering applications processing speeds ranging from 300 MHz to 1 GHz, and a new generation of Qualcomm's high-speed, multi-MAC QDSP5000™ Digital Signal Processor
- A low power consumption multimode modem, featuring an ARM9 processor and dedicated modem hardware
- Very high performance 2D and 3D graphics, and video encode and decode support
- Large-format, high-resolution Quarter Video Graphics Array (QVGA) and Video Graphics Array (VGA) displays
- Support for high levels of security for e-commerce and enterprise applications
- High speed, low power serial interface, Mobile Display Digital Interface (MDDI), optimizing the interconnection between the MSM and the LCD panel as well as supporting capabilities such as driving a PowerPoint on an external display or a video projector from a handset.
- Support for a faster, lower cost memory subsystem
Qualcomm's MSM7xxx family supports the advanced feature set of Qualcomm's Launchpad™ suite of application components and software, encompassing advanced multimedia, connectivity, position location, user interface and removable storage capabilities.
Qualcomm today also announced three new MSM6xxx family solutions - the MSM6025™ chipset solution addressing demand for data-enabled, entry-level CDMA2000 1X devices; the MSM6700™ CDMA2000 1X Revision D chipset and system software; and the MSM6275™ solution to support HSDPA, a next-generation feature of the WCDMA (UMTS) standard.
With the MSM7xxx family and the three new MSM6xxx family chipsets, Qualcomm continues to drive the industry in providing complete, fully-segmented and cost-effective CDMA solutions. Together with the existing MSM6xxx family, Qualcomm's extensive product portfolio for high-, mid- and entry-level markets meets the global requirements from manufacturers and operators for continuous creation and improvement of new wireless devices and services.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and is a 2003 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2002, and most recent Form 10-Q.