SAN DIEGO -- October 29, 2002 -- Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology today announced the on-time production shipment of the MSM6050™ Mobile Station Modem (MSM™) chipset and system software for third-generation (3G) CDMA2000 1X mobile devices. Production quantities began shipping in September 2002, and initial handsets based on the MSM6050 solution are expected early in calendar 2003.
The MSM6050 chipset solution, which features Qualcomm,s radioOne™ Zero Intermediate Frequency (ZIF) technology, consists of the RFT6100™, RFR6000™ and RFL6000™ transmit and receive chips, PM6050™ power management chip, DMSS6050™ software and the accompanying Subscriber Unit Reference (SURF™) development platform.
"We are very excited with the broad adoption of our radioOne solutions for 3G CDMA2000 1X and with more than 13 customers designing handsets using our MSM6050 chipset, we expect to see MSM6050-based terminals with new multimedia and position-location applications in the marketplace shortly," said Don Schrock, president of Qualcomm CDMA Technologies. "By delivering increased performance at lower system costs, the MSM6050 chipset and system software will accelerate the rapid deployment and success of 3G CDMA2000 1X systems throughout the world."
Qualcomm,s radioOne ZIF architecture eliminates the need for all Intermediate Frequency (IF) components Integrated Circuits (ICs), Surface Acoustic Wave (SAW) filters and Voltage-Controlled Oscillators (VCOs) thereby reducing printed-circuit-board area and bill-of-material (BOM) costs. In addition, only one external ultrahigh frequency (UHF) single-band VCO is required for all CDMA frequency bands worldwide. Both UHF receive and transmit phase locked loops (PLLs), as well as the transmit VCO, are integrated on-chip. Phones and other wireless devices designed with the radioOne chipset also benefit from the elimination of complex matching of radio frequency (RF) components.
The radioOne MSM6050 chipset is designed to deliver increased system processing power and to support the enhanced memory interfaces required by application-rich 3G terminals. With the introduction of new generations of cost-effective, high-density memory technologies for the mobile industry, the MSM6050 solution supports optimized interfaces to page-mode NOR flash for modem processing, NAND flash for applications data storage and low-cost static RAM (SRAM). This flexibility enables terminals with higher memory density and increased processor performance to be designed at lower system cost.
The new capabilities offered by the MSM6050 chipset will enable smaller form factor handsets with improved standby and talk times. For network operators, the MSM6050 solution provides up to twice the voice capacity of IS-95A/B solutions. The MSM6050 chipset supports data rates of up to 153 kbps in both the forward and reverse links simultaneously, with both turbo and convolutional codes. It also integrates a wideband mono codec, which provides cost-optimized, higher-quality audio.
The MSM6050 solution offers key features of the Launchpad™ suite of technologies, including gpsOne™ position location capabilities, Qtv™ MPEG-4 streaming video decoder, Compact Media Extension (CMX™) MIDI synthesizer, Removable Universal Identity Module (R-UIM) card interface and JPEG encoder/decoder.
In addition, the MSM6050 chip supports Qualcomm,s Binary Runtime Environment for Wireless™ (BREW™) platform Application Programming Interface (API). With the BREWapi™, handset manufacturers and developers can develop both embedded and downloadable wireless applications and BREW-based products more quickly and easily.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company,s SEC reports, including the report on Form 10-K for the year ended September 30, 2001, and most recent Form 10-Q.