Qualcomm Incorporated (Nasdaq: QCOM), developer of Code Division Multiple Access (CDMA) digital wireless technology, today announced the Company's second generation of power amplifier (PA) modules, the PA3300™ series. A joint design effort between Qualcomm CDMA Technologies (QCT) and RF Micro Devices, Inc. (Nasdaq: RFMD), the PA3300 series of PA modules - in conjunction with QCT's Mobile Station Modem (MSM™) baseband, transmit, receive and power management chips - forms the most complete and highly integrated CDMA chipset solution available in the industry today.
"The PA3300 series of power amplifier modules continues QCT's commitment to develop CDMA RF products which enable manufacturers to develop sophisticated yet cost-effective wireless handsets," said Don Schrock, president of Qualcomm CDMA Technologies. "As part of a total CDMA solution, our highly integrated PAs allow handset manufacturers to reduce production time while offering their customers longer talk-time capabilities in smaller form factors."
QCT's PA3300 series of PA modules uses an advanced Gallium Arsenide Heterojunction Bipolar Transistor (GaAs HBT) process, and is offered in a 6 x 7.5 mm 13-pin land grid array (LGA) package. Unlike other PA modules on the market that require external components such as field effect transistors (FETs) and voltage regulators to control and bias the PA, the PA3300 series integrates advanced bias control and compensation. The advanced bias control provides consistent performance of critical parameters such as gain, quiescent current and Adjacent Channel Power Rejection (ACPR) over extreme operating conditions of temperature and battery voltage. Additional features include a direct Complementary Metal Oxide Semiconductor (CMOS) interface to QCT's MSMs and an integrated power detector.
The integrated power detector in the PA3300 series eliminates the need for an external discrete power detector, which saves approximately 45-55 square mm of board space. Typically, power detectors are used for CDMA systems to ensure that the maximum power requirements of IS-98C are not exceeded, and in AMPS systems to meet transmit power accuracy requirements. To date, most manufacturers use discrete diodes, resistors, capacitors and op amps to accomplish this task; however, this discrete method of power detection requires temperature compensation and sophisticated calibration and software to obtain the needed accuracy and dynamic range. QCT's PA3300 integrated power detector provides a linear output voltage of the detected power (in dBm) with up to 30 dB of dynamic range. This linear power detector response with built-in temperature compensation simplifies the software in the system and ensures compliance with IS-98C/D specifications. All of these features help decrease manufacturers' bill of materials (BOM) costs as well as board-area.
The PA3300 series also offers a unique power step feature that allows it to be switched to low-power mode under low-output power conditions to consume less current, thereby extending a handset's overall talk-time performance by as much as 30 minutes over conventional PA modules. The power step is optimized for QCT's MSM3100™ Mobile Station Modems (MSM™) generation and later chipsets and system software.
The initial release of the PA3300 series includes the following power amplifier module versions:
- PA3300-2, for the 824 MHz - 849 MHz cellular band (dual-mode CDMA/AMPS)
- PA3300-3, for the 1850 MHz - 1910 MHz PCS band
- PA3300-3K, for the 1750 MHz - 1780 MHz PCS band
- PA3300-2J, for the 887 MHz - 925 MHz JCDMA band
- PA3300-4, for the 1900 MHz - 1980 MHz IMT band
All modules are compatible with cdma2000 1x and cdmaOne™ technology. All five modules contain corresponding frequency band impedance matching optimized for power, efficiency and linearity. The built-in 50-ohm input and output matching requires no additional components externally and permits easy "drop and place" design to facilitate handset production cycles as well as provide savings in circuit board area.
Designed to operate in handsets utilizing a single-cell Li-Ion battery design, the PA3300 modules will operate with supply voltages down to 3.2V. The U.S. cellular (PA3300-2) module will deliver 28 dBm linear output power with 28 dB gain. The JCDMA (PA3300-2J) module is designed to deliver 27.5 dBm linear output power with 28 dB linear gain. The U.S.-PCS (PA3300-3), KPCS (PA3300-3K) and IMT band (PA3300-4) modules are designed to deliver 28 dBm linear output power with 25 dB gain.
PA3300 sample shipments for cellular and U.S. PCS are available today, with Korean PCS and JCDMA samples expected to follow in the first quarter of 2001, and an IMT band version expected to sample in the second quarter of 2001.
RF Micro Devices, Inc., an ISO 9001-certified manufacturer, designs, develops, manufactures and markets proprietary RFICs for wireless communications applications such as cellular and PCS phones, cordless phones, wireless LANs, wireless local loop handsets, industrial radios, wireless security systems and remote meter readers. The company offers a broad array of products including amplifiers, mixers, modulators/demodulators, and single-chip receivers, transmitters and transceivers representing a substantial majority of the RFICs required in wireless subscriber equipment. The company's strategy is to focus on wireless markets by offering a broad range of standard and custom-designed RFICs in order to position itself as a "one-stop" solution for its customers' RFIC needs. In the September 4, 2000 issue of FORTUNE magazine, RF Micro Devices was ranked second among FORTUNE's "100 Fastest Growing Companies." RF Micro Devices, Inc. is traded on the Nasdaq National Market under the symbol RFMD.
QCT is a developer and supplier of CDMA chipsets, hardware and software solutions, and tools, with more than 118 million cumulative shipments of MSM chips worldwide. QCT offers wireless position location technology by SnapTrack, a wholly owned subsidiary of Qualcomm. QCT supplies chipsets to the world''s leading CDMA handset and infrastructure manufacturers including: Acer Peripherals, Inc., ALPS ELECTRIC CO., LTD.; CASIOCOMPUTER CO., LTD.; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and Toshiba Corporation, among others.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's business areas include integrated CDMA chipsets and system software; technology licensing; Eudora® email software for Windows® and Macintosh® computing platforms; digital cinema systems; and satellite-based systems including portions of the Globalstar™ system and wireless fleet management systems, OmniTRACS® and OmniExpress™. Qualcomm owns patents that are essential to all of the CDMA wireless telecommunications standards that have been adopted or proposed for adoption by standards-setting bodies worldwide. Qualcomm has licensed its essential CDMA patent portfolio to more than 90 telecommunications equipment manufacturers worldwide. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and is a 2000 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 2000, and most recent Form 10-Q.