Press Release

Qualcomm CDMA Technologies Exceeds 100 Million Mark in MSM Chipsets Shipped

23. Mai 2000SAN DIEGO

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced it has passed a major milestone with the shipment of more than 100 million Mobile Station Modem (MSM™) chipsets and system software to customers worldwide. The production shipment milestone for these highly integrated CDMA handset semiconductors was reached as the CDMA market continues to grow with a subscriber base that has more than doubled within the last 12 months, according to the CDMA Development Group (CDG). As the industry evolves to third-generation (3G) CDMA services, Qualcomm continues to make innovative advances in CDMA development. With more than 100 million Qualcomm-designed MSM chipsets shipped to handset manufacturers worldwide - a rapid ramp-up from the less-than-one million MSM chipsets shipped four years ago - Qualcomm remains the world's largest provider of chipsets and system software for CDMA wireless systems.

"The dramatic increase in Qualcomm's chipset production and shipping reflects not only the success of Qualcomm's CDMA products, but also the success of the fabless semiconductor business model," said Jodi Shelton, executive director of the Fabless Semiconductor Association. "As the world's largest fabless semiconductor company, Qualcomm has utilized the flexibility and responsiveness of the fabless model to supply the rapidly growing digital wireless industry's demands with tremendous acuity."

"Qualcomm's long-term partnerships with the leading CDMA handset manufacturers in the world, combined with a consistent on-time delivery record in supplying innovative CDMA products and solutions, has helped drive the rapid growth of CDMA," said Don Schrock, president of Qualcomm CDMA Technologies. "Our next generation of Internet-ready, multimedia chipsets and system software will continue that tradition of leadership by enabling manufacturers worldwide to transition smoothly to 3G systems and develop the most advanced CDMA handsets available, reducing time-to-market and cost while offering an amazing array of new products and services."

With the increasing demand for digital wireless communications and new data services, Qualcomm's MSM chipsets are now being developed on three parallel fronts:

  • The core IS-95A/B MSM3xxx product line addressing higher levels of system integration, lower system costs and increased standby times
  • The new applications iMSMxxxx product line, focusing on the emergence of smart phones and data-centric terminals based on IS-95A/B, 3G 1xMC (1x) and High Data Rate (HDR) technologies
  • The new standards MSM5xxx product line, bringing to market 3G chipsets that enable the commercialization of next-generation devices with improved voice and data capacities

To meet the growing demand for next-generation voice and data services - as well as terminals and networks - with a seamless and cost-effective migration path, Qualcomm has worked with equipment manufacturers and network operators worldwide to introduce a variety of CDMA solutions targeted for specific market needs. Recently introduced Qualcomm products and technologies that address these needs include:

  • Wireless Internet Launchpad™ suite of software applications and technologies, enabling a broad range of new terminal products and Internet services, including digital audio and video, connectivity, position location, advanced user interface and removable storage functionality
  • MSM5000™ chipset and system software, which will allow manufacturers to roll out the world's first 1x handsets that, in addition to offering rich application and feature sets in very small form-factors, will also provide significantly extended standby times as well as much higher voice capacity and data rates
  • CSM5000™ solution, providing very high integration, enabling 32 users per CSM5000 chip for 3G base stations, and supporting the IS-2000 1x standard and providing up to twice the overall capacity of voice users over IS-95A and IS-95B systems while offering backward compatibility with those previous standards
  • SnapTrack™ and gpsOne™, breakthrough position location solutions, offering robust position location information for wireless handsets under challenging conditions, whether in concrete-and-steel high-rises, convention centers, shopping malls or urban canyons
  • MSM3300™ chipset and system software, the world's first single-chip multimedia modem, providing the highest level of integration of multimedia features available for mobile phones
  • RFR3300™ device, the first in the CDMA industry to integrate GPS capability with a CDMA front-end receiver. Together with the MSM3300 chipset and IFR3300™ baseband receiver, the RFR3300 device offers the most cost-effective and high-performance solution for dual-band (PCS CDMA and AMPS) or tri-mode (cellular CDMA, AMPS, and PCS CDMA) phones with Qualcomm's gpsOne position location technology
  • IFR3300 chip, an IF-to-baseband receiver that, along with the RFR3300 device and MSM3300 chipset and system software, enables complete integration of a GPS-band radio without the need for other external IF chips
  • MSM51xx chipset and system software family, combines Wireless Internet Launchpad applications with 1x technology
  • PA3100™ Power Amplifier (PA) module, the first in a new series, extends talk-time performance for MSM3100-generation handsets. The PA3100 module has a low-power mode that can reduce current consumption by as much as 65 percent over conventional power amplifiers.

Qualcomm CDMA Technologies (QCT) is the leading developer and supplier of CDMA chipsets, hardware and software solutions and tools with more than 100 million MSM chips shipped worldwide. QCT supplies chipsets to the world's leading CDMA handset and infrastructure manufacturers including: Acer Peripherals, Inc., ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and Toshiba Corporation, among others.

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's business areas include integrated CDMA chipsets and system software; technology licensing; Eudora® email software for Windows® and Macintosh® computing platforms; satellite-based systems including portions of the Globalstar™ system and wireless fleet management systems, OmniTRACS® and OmniExpress™. Qualcomm owns patents which are essential to all of the CDMA wireless telecommunications standards that have been adopted or proposed for adoption by standards-setting bodies worldwide. Qualcomm has licensed its essential CDMA patent portfolio to more than 75 telecommunications equipment manufacturers worldwide. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and is a 2000 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development, the Company's ability to successfully manufacture significant quantities of CDMA or other equipment on a timely and profitable basis, and those related to performance guarantees, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 26, 1999, and most recent Form 10-Q.

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