Feb 28, 2000SAN DIEGO
Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
NEW ORLEANS -- February 28, 2000 -- Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced the introduction of the PA3100™ power amplifier (PA) module, the first in a new family of CDMA power amplifier modules which -- in conjunction with the MSM3100™ Mobile Station Modem (MSM™) baseband processing chip, RFT3100™ transmit and RFR3100™ receive chips, and the PM1000™ power management chip -- form the most complete and highly integrated CDMA chipset solution available. Together, the PA3100 module and the RFT3100 chip comprise the entire radio portion of the transmit chain for IS-95B compliant handsets, which is optimized by control from the MSM3100 chipset system software for fine-tuned Radio Frequency (RF) power management and talk-time savings. The PA3100 module is the first product of the recently announced alliance between Qualcomm and RF Micro Devices (Nasdaq: RFMD), a leading provider of proprietary radio frequency integrated circuits (RFICs) for wireless communications applications.
"With the introduction of the PA3100 module, Qualcomm offers manufacturers a total CDMA solution for the development of sophisticated wireless handsets," said Don Schrock, president of Qualcomm CDMA Technologies. "By tightly integrating PAs into the system solution, our customers can design their handsets faster, at the same time allowing longer talk times. The PA3100 module, the first in a new series of power amplifier modules, represents Qualcomm's ongoing commitment to develop CDMA RF products that will help drive the industry forward."
The initial release of the PA3100 series will include the following power amplifier module versions:
PA3100-2 - for the 824 MHz - 849 MHz cellular band (dual mode)
PA3100-3 - for the 1850 MHz - 1910 MHz PCS band
PA3100-3K - for the 1750 MHz - 1780 MHz PCS band
All three versions contain corresponding frequency band impedance matching, optimized for power, efficiency and linearity. The modules are internally matched to 50-ohm input and output which permits easy "drop and place" design, facilitating handset production cycles as well as savings in circuit board area.
Designed to operate in handsets utilizing a single-cell Li-Ion battery, the PCS PA3100 module delivers 28 dBm linear output power with 25 dB linear gain and 33 percent linear efficiency in CDMA mode. The cellular PA3100 module provides 28 dBm linear output power with 34 percent efficiency in CDMA mode and 31.5 dBm with 50 percent efficiency in AMPS mode. In addition to the high efficiency at maximum output power, all three PA3100 versions offer a unique gain step feature. Under low-output power conditions, the PA3100 module can be switched to low-gain mode to consume up to 65 percent less current over conventional PAs.
The PA3100 module's design uses an advanced Gallium Arsenide Heterojunction Bipolar Transistor process (GaAs HBT). All three module versions are offered in a compact 6mm x 6mm land-grid-array-style package. Sample shipping is expected to begin in Q2 2000, with production quantities expected to be available in Q3 2000.
RF Micro Devices, Inc., an ISO 9001 certified manufacturer, designs, develops, manufactures and markets proprietary RFICs for wireless communications applications such as cellular and PCS phones, cordless phones, wireless LANs, wireless local loop handsets, industrial radios, wireless security systems and remote meter readers. The Company offers a broad array of products -- including amplifiers, mixers, modulators/demodulators, and single-chip receivers, transmitters and transceivers -- that represent a substantial majority of the RFICs required in wireless subscriber equipment. The Company's strategy is to focus on wireless markets by offering a broad range of standard and custom designed RFICs in order to position itself as a "one-stop" solution for its customers' RFIC needs. RF Micro Devices, Inc. is traded on the Nasdaq National Market under the symbol RFMD.
Qualcomm CDMA Technologies (QCT), a division of Qualcomm Incorporated, is the leading developer and supplier of CDMA chipsets, hardware and software solutions, and tools, with more than 80 million MSM chips shipped worldwide. QCT supplies chipsets to the world's leading CDMA handset and infrastructure manufacturers, including: Acer Peripherals, Inc., ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and TOSHIBA Corporation, among others.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's business areas include integrated CDMA chipsets and system software; technology licensing; Eudora® email software for Windows® and Macintosh® computing platforms; and satellite-based systems including OmniTRACS® and portions of the Globalstar™ system. Qualcomm owns patents which are essential to all of the CDMA wireless telecommunications standards that have been adopted or proposed for adoption by standards-setting bodies worldwide. Qualcomm has licensed its essential CDMA patent portfolio to more than 75 telecommunications equipment manufacturers worldwide. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and is a 1999 FORTUNE 500® company traded on the Nasdaq under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development, the Company's ability to successfully manufacture significant quantities of CDMA or other equipment on a timely and profitable basis, and those related to performance guarantees, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 26, 1999, and most recent Form 10-Q.