Press Release

Qualcomm Introduces Next-Generation CDMA RF and Analog Chipsets

Feb 8, 1999SAN DIEGO

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

NEW ORLEANS -- February 8, 1999 -- Qualcomm Incorporated (NASDAQ: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced the introduction of its next-generation series of Radio Frequency (RF) and analog chips. Components of the complete CDMA chipset solution for Qualcomm's next generation MSM3100™ baseband processing chip include the RFT3100™ transmit (Tx) and RFR3100™ receive (Rx) processors featuring unmatched savings in board area with significant reductions in power consumption over previous generations. Also introduced today is the PM1000™ power management chip, which provides battery supervision and charging functions, programmable voltage regulation, and integration of other collateral support functionality for CDMA handset applications.

The new chipsets will operate directly with Qualcomm CDMA Technologies' newest MSM3100 baseband processing solution and together form the most complete CDMA transmit/receive and power management chipset solution to-date. Breakthrough new CDMA RF systems and process technology has been applied to the development and enabled these new devices to provide unmatched area and power savings. State of the art Silicon Germanium (SiGe) process technology is used to achieve superior RF receiver performance and integration. The complete solution including the MSM3100 chipset and software provides a highly efficient and fully compliant IS-95A or IS-95B CDMA handset solution. The RFT3100 and RFR3100 chipset is designed for transmit and receive compatibility with cellular as well as Personal Communications Service (PCS) frequency bands covering global CDMA markets.

"CDMA products based on the MSM 3100 series chipset solution, utilizing new technologies like SiGe, will set the new standard of excellence for worldwide wireless subscriber equipment," said Johan Lodenius, vice president of marketing for Qualcomm CDMA Technologies. "This enables handset manufacturers to design a new generation of significantly smaller and lighter multi-band handsets with very long standby times and rich data capabilities at lower production costs."

RFT3100 Transmit Processor
The RFT3100 Baseband-to-RF Transmit Processor performs all transmit signal processing functions required between digital baseband and the power amplifier (PA) for IS-95 CDMA cellular and PCS single-band and dual-band applications. It connects directly to the MSM3100 chip utilizing an analog baseband interface, which is upconverted to the cellular or PCS frequency bands with the required output power to drive the PA.

The RFT3100 transmit processor offers the most advanced and integrated CDMA Transmit solution available today, providing a printed circuit board area savings of more than 65 percent over previous generation chipsets and optimized power savings for extended talk-time performance. It incorporates the previous generation functionality of the IFT3000™ Baseband-to-IF Processor together with the transmit processing of the Qualcomm UD3000 IF to RF transmit converter all in an ultra small 32-pin bump chip carrier (BCC++) plastic package. The RFT3100 chip is fabricated in an advanced BiCMOS process which enables both precision high-frequency analog circuits and low-power CMOS functions.

RFR3100 Receive Processor
The RFR3100 RF-to-IF Receive Processor offers the most advanced and integrated CDMA receive solution designed to meet cascaded Noise Figure (NF) and Third-order Intercept Point (IIP3) requirements of IS-98 and JSTD-018 specifications for sensitivity, two-tone intermodulation, and single-tone desense. It performs all of the front-end receive (Rx) signal processing required between the antenna and the Qualcomm IFR3000™ IF-to-Baseband Processor for IS-95 CDMA cellular and PCS single-band and dual-band applications. The RFR3100 processor integrates dual-band Low Noise Amplifiers (LNAs) and mixers for downconversion from RF to CDMA and FM Intermediate Frequency (IF), and together with the IFR3000 chip, comprise a complete RF-to-Baseband chipset solution for the Rx path. This device is fabricated on an advanced silicon germanium (SiGe) BiCMOS process which enables low-noise, high-linearity, high-frequency analog circuits along with low-power CMOS functions, and will be available in a 32-pin BCC++ plastic package.

PM1000 Power Management Chip
The PM1000 chip is a complete power management system device for CDMA mobile handset applications whose primary functions provide battery management and charger control as well as linear voltage regulation with programmable voltages for digital and RF/analog circuits. The battery management includes over-voltage and over-current protection, low battery alarm and accurate battery gas gauge. The charger control includes fast charge and trickle charge modes for Lithium-Ion (Li-Ion) and Nickel Metal Hydride (NiMH) batteries. The voltage regulation includes power-on reset control.

In addition to the power management functions, the PM1000 chip also contains a variety of collateral support functionality including a keyboard backlight driver, Liquid Crystal Display (LCD) backlight driver, ringer/buzzer driver, a vibrator driver, support for electro-luminescent display driver, a Real Time Clock, and general purpose Analog-to-Digital Converter (ADC). All PM1000 operating modes and functionality can be controlled by the MSM3100's microprocessor through its three wire Serial Bus Interface (SBI). This chip will be available in a 64 plastic ball grid array (PBGA) package.

Qualcomm will begin sample shipping the RFT3100, RFR3100, and PM1000 to customers in the third quarter of 1999; production quantities are expected to be available in the fourth quarter of 1999.

Qualcomm CDMA Technologies is the leading developer and supplier of CDMA chipsets, hardware and software solutions and tools with more than 30 million MSM chips shipped worldwide. The division supplies chipsets to the world's leading CDMA handset and infrastructure manufacturers including: ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and Toshiba Corporation, among others.

Qualcomm Incorporated (NASDAQ: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's major business areas include CDMA phones; integrated CDMA chipsets and system software; wireless infrastructure; technology licensing; and satellite-based systems including OmniTRACS® and portions of the Globalstar™ system. Qualcomm is headquartered in San Diego, Calif. Qualcomm's fiscal 1998 revenues exceeded U.S. $3 billion. For more information, please visit the Company's web site at www.qualcomm.com.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development, the Company's ability to successfully manufacture significant quantities of CDMA or other equipment on a timely and profitable basis, and those related to performance guarantees, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 27, 1998, and most recent Form 10-Q.

###

For press inquiries, view our Press Contacts page.