Press Release

Qualcomm Announces Sixth Generation CDMA Single-Chip Modem Solution

8 de feb. de 1999NEW ORLEANS

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (NASDAQ: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced the introduction of the MSM3100™, the company's sixth generation single-chip Mobile Station Modem™ (MSM™) baseband processing solution. This new generation chipset and system software solution features a 50 percent reduction in chip size and up to 300 hours of standby time."Our business is to work closely with the industry to define, develop and deliver on future needs for wireless communication," said Don Schrock, president of Qualcomm's CDMA Technologies. "With the introduction of the sixth-generation MSM3100 chipset and software, we are taking our proven CDMA solutions to the next level of integration and cost savings while adding support for new high performance voice and data processing features. Combined with new tools and our world-class technical support staff, this ensures continued industry leading phone development times for our customers."The MSM3100 chipset and software enable design of a new generation of CDMA handsets and data devices with rich feature sets and industry-leading performance. Higher on-chip integration now includes the addition of analog cores such as a 13-bit linear audio-codec, PLL, DAC's and ADC's. This facilitates a 50 percent size reduction of the printed circuit board area as well as a significantly reduced part count and lower bill-of-materials cost.With new system software and hardware for enhanced system power control, stand-by times will also be approximately 50 percent higher than previous generation solutions. The MSM3100 chip incorporates advanced digital signal processing (DSP) functions, a Universal Serial Bus (USB) high speed data interface and support for additional CDMA Designer™ development tools. These enhancements allow phone manufacturers to further innovate and differentiate their CDMA handsets while reducing time-to-revenue.New features include: Enhanced voice recognition, such as continuous digit dialing and support for large speaker independent libraries; and on-chip acoustic echo cancellation, eliminating the need for additional costly hardware in automotive, PC and other speaker phone applications. A Universal Serial Bus (USB) interface enables effective interconnection to desktop, laptop and Palm PC devices for much higher speed multimedia data transfers and software synchronization. The MSM3100 chip will also be the first baseband modem in the world to offer on-chip hardware support for in-phone Global Positioning System (GPS)-based CDMA position and location services which provides manufacturers with a cost-effective and integrated solution for the upcoming FCC mandate for emergency location tracking (E911)."This is our most powerful chip to date," said Johan Lodenius, vice president of marketing for Qualcomm's CDMA Technologies. "The MSM3100 solution provides a comprehensive set of advanced features with supporting tools as well as a robust and proven software package. This will enable CDMA handset manufactures to create a wide array of products with unprecedented functionality, form factors and operating performance."Features of the MSM3100 Chip Include:


  • Qualcomm's newly developed integrated QDSP2000 digital signal processing (DSP) core, easily enables the additional performance requirement for advanced features such as voice recognition, GPS-based position location, speech compression, acoustic echo cancellation, noise suppression, and other audio enhancements. Acoustic echo cancellation support in the QDSP2000 core eliminates the need for DSP's in car-kits for additional cost savings.

  • The QDSP2000 core features 40-bit computation units and datapaths, up to five operational executions in parallel, variable-length instructions to conserve program memory, and single-cycle instruction execution for computations. The powerful QDSP2000 consumes less power with better performance and only requires 8 Mips for Enhanced Variable Rate Coder (EVRC) execution, versus competitive digital signal processors requiring more than 20 Mips. A complete GUI-based software development toolkit for Sun and PC platforms is available for customized features.

  • The integrated industry-standard ARM7 TDMI® microprocessor offering much higher performance with lower power consumption and smaller relative compiled-code size. The ARM7 is ideal for support of manufacturer application demands today as well as for the future. To facilitate software development the ARM peripherals have been customized by Qualcomm to facilitate in-phone debugging capabilities of production handsets. ARM software tools are available directly from Qualcomm to assist manufacturers with software development.

  • Support for CDMA position location services utilizing GPS-based technology. This provides manufacturers with a cost effective and highly-integrated solution for the upcoming FCC E911 mandate.

  • IS-95B compliant demodulator architecture, to support simultaneous demodulation of up to six or eight channels, depending on the rate-set used, for a maximum speed of 86.4 kilobits per second (kbps).

  • Various analog cores are integrated onto the MSM3100 chip, reducing the number of handset components for substantial cost savings and reduction of PCB area. Included on the chip are: A 13-bit linear audio voice codec with Automatic Gain Control (AGC) function and integrated earphone amplifiers; PLL for support of various TCXO frequencies; on-chip voltage regulators for a single 2.5 volt (v) input interface that support internal chip voltages as low as 1.8 v; dual 8-bit transmit IQ DAC's which simplify the interface to the transmit Radio Frequency (RF) chain; and ADC's for battery and temperature monitoring. This level of integration enables shrinking of the printed circuit board by 50 percent for a very cost effective and low power design.

  • A new enhanced sleep controller for both CDMA and AMPS modes will cut power consumption significantly in the MSM chip and for the entire phone. For example, an estimated 300 hours of stand-by time can be achieved in CDMA mode.

  • Multiple serial interfaces including: Universal Asynchronous Receive Transmits (UARTs) for data communications as well as diagnostic monitoring; Qualcomm developed Serial Bus Interface (SBI) for low speed control of RF and peripheral devices for power management; and USB for easy interconnection to a PC or car kit. With the greatly increasing popularity of USB in the PC marketplace, this interface is ideal for plug and play mobile phone connections to PC's and consumer appliances.

  • An optimized system software solution which is fully compliant with dual-mode cellular and Personal Communications Service (PCS) band IS-95B specifications. The software includes a full suite of Internet protocols for fast development of data applications and ships fully tested and integrated into Qualcomm's CDMA development tools for fast and flexible customer development.

Qualcomm's MSM3100 chip interfaces directly with the IFR3000™ chip, the RFR3100™ and RFT3100™ chips, Qualcomm's next generation fully integrated Intermediate Frequency (IF) chipset and the new PM1000™ power management chip.System development software, verification, test, debug, calibration, manufacturing and field test support are available using the CDMA Designer development tools reducing time to market for a complete CDMA handset. Target applications include very small voice, high data rate and advanced user interface subscriber units for multi-mode cellular and PCS CDMA services.The MSM3100 chip will be fabricated in a 0.18 um Leff process at 2.5V ± 10% in 0.8mm ball pitch 208-pin Fine Pitched Ball Grid Array (FBGA) package. For maximum current savings, the internal cores of the chip will operate down to 1.8 v. The 208-pin FBGA package is in a four-perimeter-rows-of-solder-balls (P4) configuration making circuit routing and assembly easier and enabling the use of cost effective printed circuit boards. Sample shipment to customers will begin in the third quarter of 1999 with production volumes starting by the end of the year.Qualcomm CDMA Technologies is the leading developer and supplier of CDMA chipsets, hardware and software solutions and tools with more than 30 million MSM chips shipped worldwide. The division supplies chipsets to the world's leading CDMA handset and infrastructure manufacturers including: ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and Toshiba Corporation, among others.Qualcomm Incorporated (NASDAQ: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's major business areas include CDMA phones; integrated CDMA chipsets and system software; wireless infrastructure; technology licensing; and satellite-based systems including OmniTRACS® and portions of the Globalstar™ system. Qualcomm is headquartered in San Diego, Calif. Qualcomm's fiscal 1998 revenues exceeded U.S. $3 billion. For more information, please visit the Company's web site at www.qualcomm.com.Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development, the Company's ability to successfully manufacture significant quantities of CDMA or other equipment on a timely and profitable basis, and those related to performance guarantees, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 27, 1998, and most recent Form 10-Q.###

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