Feb 1, 1999SAN DIEGO
Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
SAN DIEGO -- February 1, 1999 -- Qualcomm Incorporated (NASDAQ: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today introduced new packaging for its industry-leading MSM3000™ Mobile Station Modem (MSM™) and IFT3000™ and IFR3000™ fully integrated Intermediate Frequency (IF) chipsets. The new packaging offers manufacturers the ability to design very small handsets and other devices, giving greater flexibility to develop differentiated products.
The MSM3000 chip, currently being shipped to customers, will be available in a 176 Fine Pitched Ball Grid Array (FBGA) package with a footprint measuring 169 square millimeters (mm) with a volume of 237 cubic mm. This represents reductions of 25 percent in the mounting footprint and 40 percent in the volume of the current 196 Plastic Ball Grid Array (PBGA) production package while providing the same functionality. The MSM3000 chip is currently in volume production in a 176 Thin Quad Flat Pack (TQFP) and a 196 PBGA. The new 176 FBGA package is also offered in a four-perimeter-rows-of-solder-balls (P4) configuration, with a 0.8 mm ball pitch, making circuit routing and assembly easier and enabling the use of cost effective printed circuit boards.
"Leading with new package technologies will enable even further reductions in the size of wireless phones," said Luis Pineda, director of product management for Qualcomm's ASIC Products. "We continue to work closely with our customers to help them differentiate their phones and offer flexibility in the design of next-generation wireless devices."
Together, Qualcomm's MSM3000 chip, the IFT3000 and IFR3000 fully integrated Intermediate Frequency (IF) chipset, and the RF front end constitute the system hardware necessary for an IS-95A or IS-95B CDMA compliant handset. These IF devices are the first chips incorporating the complete IF functionality for a CDMA handset, from digital baseband converters to Automatic Gain Control (AGC).
Both the IFT3000 and IFR3000 are now offered in a Bump Chip Carrier (BCC) ultra small chip-size package. The 48-pin BCC package measures 49 square mm and has a low 0.8 mm profile. This is a 40 percent reduction in the mounting footprint of the current IFT3000 and IFR3000 production package, the 48-pin TQFP. The BCC style package has peripheral mounted pads to simplify manufacturing and printed circuit board layout considerations providing improved electrical performance.
The IFT3000 BCC, IFR3000 BCC and MSM3000 176 FBGA samples are available this quarter. Daisy chain samples, with no active inside circuits, are also available to ready handset manufacturing lines.
Qualcomm ASIC Products Division is the leading developer and supplier of CDMA chipsets, hardware and software solutions and tools with more than 30million MSM chips shipped worldwide. The ASIC Products Division supplies chipsets to the world's leading CDMA handset and infrastructure manufacturers including: ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; LG Information andCommunications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and TOSHIBA CORPORATION, among others.
Qualcomm Incorporated (NASDAQ: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's major business areas include CDMA phones; Application Specific Integrated Circuits (ASICs); wireless infrastructure; technology licensing; and satellite-based systems including OmniTRACS® and portions of the Globalstar™ system. Qualcomm is headquartered in San Diego, Calif. Qualcomm's fiscal 1998 revenues exceeded U.S. $3 billion. For moreinformation, please visit the Company's web site at http://www.qualcomm.com.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development, the Company's abilityto successfully manufacture significant quantities of CDMA or other equipment on a timely and profitable basis, and those related to performance guarantees, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 1998, and most recent Form 10-Q.