Qualcomm Incorporated (NASDAQ:QCOM) today announced the availability of production quantities of MSM2310™, Mobile Station Modem™ (MSM™), the first-ever integrated single-chip tri-mode vocoder solution supporting Enhanced Variable Rate Vocoder (EVRC).
The MSM2310, a derivative of the highly successful, industry standard MSM2300™, supports all three Code Division Multiple Access (CDMA) vocoders, 8k Qualcomm Code Excited Linear Prediction (QCELP™), 13 kilobits (k) QCELP and EVRC, allowing customers easy integration from the MSM2300 and simplifying production of phones for the global market. MSM2310 will enable customers to produce smaller EVRC CDMA handsets by reducing the necessary board area by an estimated minimum 200 square millimeters (mm), allowing for design at less than 100 grams.
"With the introduction of MSM2310 we continue our mission to provide proven, leading-edge, cost-effective and high performance semiconductor products for CDMA applications worldwide. We are responding to our customers' needs to support a variety of vocoders and the additional audio processing required to achieve high voice quality field performance. We continue to lead our industry in providing innovative solutions meeting our customers' bottom-line goals," said Donald Schrock, president of Qualcomm's ASIC Division.
In early carrier testing of the MSM2310, superior results and performance were seen for Qualcomm's innovative implementation of EVRC, delivering high quality results over other competitors' solutions.
System on a Chip
The MSM2310 is built upon Qualcomm's successful fourth-generation MSM2300 architecture used in worldwide CDMA phone production which includes proprietary CDMA building blocks, a microprocessor and several DSP cores integrated onto a single chip. The MSM2310 is based on the MSM2300 with additional support for EVRC. Applications include subscriber units for worldwide multi-mode cellular, Personal Communications Services (PCS) handset and data communication devices. Qualcomm's proven MSM2300 series baseband and Intermediate Frequency (IF) chipset and Radio Frequency (RF) front end make up all the system hardware necessary for an entire IS-95A or IS-95B CDMA compliant subscriber unit.
"Qualcomm has again demonstrated its commitment to its customers by innovating and improving its products to give us maximum flexibility, proven performance and improved features at a competitive cost. The MSM2310 product is another example of this level of commitment with its integrated tri-mode features and very low power consumption, enabling Sony to produce world-class products that consumers are demanding today," said Yutaka Sato, president of Sony Personal Mobile Communications-America.
The single-chip MSM2310 device is pin-compatible with MSM2300 and facilitates easy migration for customers using existing MSM2300-based board design with a minor software upgrade. This enables rapid design of EVRC capable handsets and allows for the easy elimination of costly DSP solutions, realizing an instant cost savings to customers.
The single-chip MSM2310 performs additional signal processing functions required for enhanced real-life performance including noise cancellation, acoustic echo cancellation and DTMF generation. The MSM2310 also maintains the very low power consumption features inherent in the MSM2300 architecture and ships with the latest version of MSM2300 software. The total EVRC implementation runs at less than 20 Millions of Instructions Per Second (MIPS), which is significantly lower than other solutions and results in longer stand-by and talk time.
"MSM2310 enables our customers to meet the increasing demand for EVRC voice coding replacing external DSP's for a more cost- and power-efficient single-chip solution. In working closely with our customers we have fine tuned the voice quality and added high performance noise suppression and ear-seal echo cancellation for high-quality field performance," said Johan Lodenius, vice president of marketing for Qualcomm's ASIC Division. "The MSM2310 is the first integrated tri-mode vocoder mobile station modem shipping in production quantities. This gives our customers a huge time-to-market advantage over other announced competitive solutions."
Production Quantities Available Now
Production quantities of the MSM2310 are now available in two sizes, the 196-ball Plastic Ball Grid Array (PBGA) package and a 176-pin Thin Quad Flat Pack (TQFP) package. The 196-ball PBGA packages have a high lead countper area, and unlike (TQFP), require no additional board space for lead extensions outside the package body. The 196-ball PBGA package footprint measures 225 square mm; 33 percent the size of the 176-pin (TQFP).
- The MSM2310 is based on MSM2300 architecture and facilitates an easy migration path by using the exact same pinout as the MSM2300 making the MSM2310 a drop-in replacement on a printed circuit board;
- Optimized DSP code for EVRC, operating at less than 20 MIPS for low-power consumption and longer standby times;
- EVRC provides higher capacity in CDMA networks by providing a lower average bit rate comparable to 8k QCELP;
- Faster, more efficient search engine and higher performance demodulation gives customers more flexibility;
- Supports EVRC, compliant with TIA IS-127, in addition to 8k and 13k QCELP vocoders using a higher performance Qualcomm-developed DSP optimized to run voice processing with very low power consumption;
- Supports acoustic ear-seal echo cancellation, noise cancellation and other functions required to make a superior sounding handset for real-world noisy environments;
- Delivered with an additional software release enabling EVRC option;
- Enhanced clock management circuitry;
- Enhanced Viterbi decoder;
- Internal microprocessor and DSP; and
- Production quantities shipping now to customers.
Headquartered in San Diego, Qualcomm develops, manufactures, markets, licenses, and operates advanced communications systems and products based on its proprietary digital wireless technologies. The Company's primary product areas are CDMA wireless communications systems and products, the OmniTRACS® system (a geostationary satellite-based, mobile communications system providing two-way data and position reporting services) and, in conjunction with others, the development of the Globalstar™ low-earth-orbit (LEO) satellite communications system. Other Company products include the Eudora Pro® electronic mail software, ASIC products, and communications equipment and systems for government and commercial customers worldwide. For more information on Qualcomm products andtechnologies, please visit the Company's web site at http://www.qualcomm.com/.
Except for the historical information contained herein, this news release contains forward- looking statements that are subject to risks and uncertainties, including timely product development and commercial implementation of the Company's products, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 1997 and most recent Form 10-Q.
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Qualcomm, OmniTRACS, QCELP and Eudora Pro are registered trademarks MSM, MSM2300 and MSM2310 are trademarks of Qualcomm Incorporated. Globalstar is a trademark of Loral Qualcomm Satellite Services, Incorporated.
June 30, 1998June 30, 1998Qualcomm Announces Production Shipping of First-Ever Integrated Tri-Mode Vocoder Mobile Station ModemQualcomm Announces Production Shipping of First-Ever Integrated Tri-Mode Vocoder Mobile Station Modem