Qualcomm Incorporated (NASDAQ: QCOM) today announced the introduction of the IFR3000 and IFT3000 chipset performing all signal processing functions required between digital baseband and the Radio Frequency (RF) front-end for IS-95 CDMA applications. The IFR3000 for Receive, and IFT3000 for Transmit, Intermediate Frequency (IF) converters provide an easier and more economic design solution for IF-to-Baseband and Baseband-to-IF in addition to added functionality and system flexibility. The Qualcomm IF chipset offers an area size reduction of at least 45 percent over previous generation chipsets, supply voltage operation down to 2.7 V and substantially reduced power consumption.
Target applications are subscriber units or data communication devices for multi-mode cellular, Personal Communications Services (PCS) and Wireless Local Loop (WLL) systems. The IFR3000 and IFT3000 interface directly with Qualcomm's MSM2300 series or MSM3000 series digital baseband chips and RFRx and Tx front ends. The combination of an IFR3000, IFT3000 and MSM chip comprise the core of a handheld IS-95A or IS-95B compliant subscriber unit.
"These are the first chips incorporating the complete integrated IF functionality for CDMA from baseband converters to AGC's, enabling design of even smaller form-factor handsets with lower power consumption," said Johan Lodenius, vice President of marketing for Qualcomm's ASIC Products Division.
The IFR3000 includes Rx power control through a 90 dB dynamic range AGC amplifier, IF mixer for downconverting IF to analog baseband, and analog-to-digital converters (ADCs) for converting CDMA and FM analog baseband signals to digital baseband.
The IFT3000 includes digital-to-analog converters (DACs) for converting digital baseband to analog baseband, an IF mixer for upconverting analog baseband to IF, Tx power control through 85 dB dynamic range AGC amplifier, a programmable PLL for generating Tx IF frequency, and a general purpose ADC with three analog inputs.
When combined with Qualcomm's MSM3000, enhanced features such as slotted digital FM Mode and selective power-down can be utilized to significantly increase phone standby time.
"With the introduction of these new IF chips we continue to show our commitment to excellence in all aspects of CDMA handset design. As we continue our mission to provide the best performing, cost-competitive chipset solutions for CDMA, we look carefully at all hardware as well as software content necessary to achieve true system optimization," said Donald Schrock, president of Qualcomm's ASIC Products Division.
The IFR3000 and IFT3000 are provided in a 48-lead TQFP package. Engineering samples are expected to be available in the third quarter of 1998 with production quantities expected in the fourth quarter of 1998.
Headquartered in San Diego, Qualcomm develops, manufactures, markets, licenses, and operates advanced communications systems and products based on its proprietary digital wireless technologies. The Company's primary product areas are CDMA wireless communications systems and products, the OmniTRACS® system (a geostationary satellite-based, mobile communications system providing two-way data and position reporting services) and, in conjunction with others, the development of the Globalstar™ low-earth-orbit (LEO) satellite communications system. Other Company products include the Eudora Pro™ electronic mail software, ASIC products, and communications equipment and systems for government and commercial customers worldwide. For more information on Qualcomm products and technologies, please visit the Company's web site at http://www.qualcomm.com/.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development and commercial implementation of the Company's products, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 1997 and most recent Form 10-Q.
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