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Press Release

Qualcomm Enables Smaller CDMA Handsets with Cutting Edge ASIC Packaging Technology

Sep 9, 1997
DALLAS

Qualcomm Incorporated (NASDAQ: QCOM) today announced the availability of the MSM2300™ (Mobile Station Modem) in a 196-ball Plastic Ball Grid Array (PBGA) package. PBGA packages have a high lead count per area, and unlike Quad Flat Packs (QFP), require no additional board space for lead extensions outside the package body. The 196-ball PBGA package footprint measures 225 square mm. This is 33 percent of the size of the current MSM2300 production package, the 176-pin Thin Quad Flat Pack (TQFP).

"With the global push toward miniaturization of phones and a recognized need for ASICs, we are focused on providing our customers with new package alternatives which are cost competitive and reliable, and can be easily implemented into manufacturing lines," said Don Schrock, senior vice president and general manager of Qualcomm's ASIC Products Division.

CDMA customers worldwide received daisy chain PBGA samples in August. Daisy chain samples are PBGA packages with no active circuits inside. Customers will use these devices to ready their manufacturing lines to accommodate the new package. Qualcomm has already received orders for MSM2300 PBGA samples to be shipped in mid September and production quantities in December 1997.

"Our customers are facing increasingly stringent requirements on the size of their Code Division Multiple Access (CDMA) phones," said Johan Lodenius, director of marketing for Qualcomm's ASIC Products Division. "The MSM2300 PBGA allows us to continue to pack the maximum CDMA functionality into the smallest possible space."

Headquartered in San Diego, Qualcomm develops, manufactures, markets, licenses and operates advanced communications systems and products based on its proprietary digital wireless technologies. The Company's primary product areas are the OmniTRACS® system (a geostationary satellite-based, mobile communications system providing two-way data and position reporting services), CDMA wireless communications systems and products and, in conjunction with others, the development of the Globalstar™ low-earth-orbit (LEO) satellite communications system. Other Company products include the Eudora Pro™ electronic mail software, ASIC products, and communications equipment and systems for government and commercial customers worldwide. For more information on Qualcomm products and technologies, please visit the Company's web site at http://www.qualcomm.com.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development, commercial implementation of the Company's technology, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 1996 and most recent Form 10-Qs.

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Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm, Qualcomm Dragonwing and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.

Qualcomm, OmniTRACS and Eudora are registered trademarks, and Q phone, MSM2300 and Eudora Pro are trademarks of Qualcomm Incorporated. Globalstar is a trademark of Loral Qualcomm Satellite Services, Incorporated.

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Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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