Press Release

Qualcomm Announces New Low-Power CDMA Base Station Chipset

1997年3月3日SAN FRANCISCO

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (NASDAQ:QCOM) today announced a CDMA infrastructure chipset which includes a new, low power Cell Site Modem (CSM) and the Frame Interface and Router Module (FIRM) for base station communications. These two devices together with a microprocessor encompass the main baseband elements of a CDMA Cellular or PCS base station. CDMA infrastructure and test equipment manufacturers using the CSM and FIRM will realize significant power and cost reduction with these new highly integrated devices.

"With this new chipset, we are addressing the increasing market demand for optimized CDMA Base Station and Test Equipment solutions. A very compact and scalable architecture can be achieved using CSM and FIRM," said Johan Lodenius, Director of Marketing of Qualcomm's ASIC Business Unit.

The new CSM1.5 (Q5165) is a CDMA digital baseband modem which incorporates the CDMA Modulator, CDMA Demodulator, and Serial Viterbi Decoder to provide reduced cost and improved functionality in the base station. The CSM1.5 requires a single power supply operating between 2.7 and 3.6 volts, and consumes 40 percent less power than Qualcomm's first generation CSM ASIC(CSM1.0). The CSM1.5 comes in a 100-pin TQFP package making its footprint only two thirds the size of the CSM1.0, and its height only half the height of the CSM1.0. The CSM1.5 has a flexible microprocessor interface which makes it compatible with any base station design regardless of CPU preference. Also, the CSM1.5 is completely software compatible with the CSM1.0.

The FIRM ASIC (Q5182) plays an important role in the Base Station Communication Network. It processes, buffers and routes packets containing digital voice data. This processing enables the various subsystems in a CDMA Cellular Land Network to communicate with each other. The FIRM ASIC represents a significant cost reduction to infrastructure manufacturers combining the functions of several separate HDLC controllers, FIFOs and other peripherals chips into one device. For control, the device has an asynchronous interface that enables a microcontroller to directly access it's registers. The FIRM allows hardware designers to reduce the size of their printed circuit boards, reduce the number of traces on the boards, lower the power dissipation and simplify their software.

"Qualcomm is committed to provide high quality integrated circuits for CDMA applications, enabling infrastucture and test equipment suppliers to continually increase the functionality and decrease the cost of their products," said Donald Schrock, Senior Vice President and General Manager of Qualcomm's ASIC Business Unit.

Engineering samples and production quantities are currently available from Qualcomm for both the CSM and FIRM devices.

Headquartered in San Diego, Qualcomm develops, manufactures, markets, licenses and operates advanced communications systems and products based on its proprietary digital wireless technologies. The Company's primary product areas are the OmniTRACS® system (a geostationary satellite-based, mobile communications system providing two-way data and position reporting services), CDMA wireless communications systems and products and, in conjunction with others, the development of the Globalstar™ low-earth-orbit (LEO) satellite communications system. Other Company products include the Eudora Pro™ electronic mail software, ASIC products, and communications equipment and systems for government and commercial customers worldwide. For more information on Qualcomm products and technologies, please visit the Company's web site at http://www.qualcomm.com.

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