OnQ Blog

Qualcomm 3D Sonic Max wins CES 2021 Innovation Award

Jan 6, 2021

Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

The annual Consumer Electronic Show (CES) in Las Vegas is a worldwide exhibit and award show for the most cutting-edge technology. This year, CES awarded Qualcomm Technologies a CES 2021 Innovation Award for the Qualcomm 3D Sonic Max. Introduced last year, it’s our largest (20x30mm2) and most advanced fingerprint sensor based on ultrasonic technology.

The Qualcomm 3D Sonic Sensor enables mobile devices to deliver a high-performance fingerprint security solution that lives beneath a smartphone screen’s surface, tapping single-touch authentication that uses sound waves to recognize and safeguard users. The sensor uses pulse echo sound reflections to create an image of the 3D fingerprint ridges and valleys, and is capable of imaging through wet fingers and contaminants.

At a mere 0.2mm, it’s ultra-thin, too. This enables OEMs to build cutting-edge form factors, such as full glass edge-to-edge displays and flexible OLED displays.

“CES 2021 Innovation Awards Program is an annual competition honoring outstanding design and engineering in consumer technology products,” says CES of the award. The program recognizes honorees in a multitude of consumer technology product categories and distinguishes the highest rated in each.”

The Qualcomm 3D Sonic Max was recognized with an “Embedded Technologies” category award. It’s 17x bigger than its predecessor, and it enables new advanced security features and experiences including the ability to read two fingerprints simultaneously and to register one’s fingerprint with a single tap.

Mobile devices with Qualcomm 3D Sonic Max are expected to be available later this year. You can read more about Qualcomm 3D Sonic Max here.

Qualcomm 3D Sonic Max is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Opinions expressed in the content posted here are the personal opinions of the original authors, and do not necessarily reflect those of Qualcomm Incorporated or its subsidiaries ("Qualcomm"). Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries. The content is provided for informational purposes only and is not meant to be an endorsement or representation by Qualcomm or any other party. This site may also provide links or references to non-Qualcomm sites and resources. Qualcomm makes no representations, warranties, or other commitments whatsoever about any non-Qualcomm sites or third-party resources that may be referenced, accessible from, or linked to this site.

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