Oct 17, 2016
Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
Today Qualcomm Technologies introduced three new processors in the popular Snapdragon 600 and 400 tiers; the Qualcomm Snapdragon 653, Snapdragon 626, and Snapdragon 427. All three introduce enhancements over previous generation chipsets and are engineered to boost performance, enhance connectivity, and help improve charge times.
Along with design improvements, we shared new details on how popular the 600 tier has become for customers. Over the last twelve months, 400 OEM designs based on our Snapdragon 600-tier chipsets have launched or are currently in the design pipeline. This is an important, high-growth segment, which is why we continue to innovate in these tiers.
What is new?
They share the below capabilities--new to span across these tiers—that customers will see immediate benefit from:
- Integrated Snapdragon X9 LTE modem Cat 7 downlink / Cat 13 uplink (300Mbps DL; 150Mbps UL), engineered to achieve up-to 50 percent faster upload speeds than the X8 LTE
- Qualcomm Quick Charge 3.0 technology, designed to deliver power up to 4X faster compared to traditional charging methods
- Dual camera support for clear imaging and photos across a wide variety of lighting and shooting situations
Each processor also has a number of unique capabilities that deliver differentiating value for OEMs and users:
The Snapdragon 653 processor is engineered to support 10 percent higher performance compared to the 652, thanks to a CPU speed increase up-to 1.95GHz, along with additional architectural improvements. Addressable RAM has doubled, up to 8GB, designed to improve multitasking and overall system performance. The Snapdragon 653 also implements Enhanced Voice Services (EVS) on VoLTE calls—another way of saying your calls can sound incredible when using this service on your carrier’s network. The Snapdragon 653 is pin and software compatible with Snapdragon 650 and 652.
Snapdragon 626 is designed to deliver CPU speeds of up-to 2.2GHz, for as much as a 10 percent performance improvement over the 625, and also implements Qualcomm TruSignal antenna boost. TruSignal is engineered to improve signal reception in congested areas, making voice and data connections reliable and with superior quality. Snapdragon 626 is pin and software compatible with Snapdragon 625, and software compatible with the Snapdragon 425, 427, 430, and 435 processors.
By adding the Snapdragon X9 LTE modem to this processor, OEMs will have the option to swap out the Snapdragon 425 for carriers in regions that support the faster speeds offered by this Cat 7 modem, saving both time and cost on device design. The Snapdragon 427 is the first in the Snapdragon 400 family to offer TruSignal antenna tuning. TruSignal is now available and improving voice and data quality on Snapdragon 800, 600 and 400 tier processors. Snapdragon 427 is pin and software compatible with Snapdragon 425, 430 and 435, and software compatible with Snapdragon 625 and 626.
These new processors help complement existing OEM device deployment plans by delivering key enhancements and performance improvements for important customer and geographic regions. The Snapdragon 653 and 626 processors are expected to be available to customers later this fall, and devices featuring the Snapdragon 427 are expected to be available early next year.