Jan 6, 2016
Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm chief executive officer Steve Mollenkopf took to the stage yesterday at CES 2016 to provide a roomful of tech journalists and industry analysts with a few updates on what to expect from Qualcomm at CES, and also in the company’s future endeavors.
Mollenkopf began by discussing the company’s core focus, to which he attributed its historic success. "We've been around for 30 years, and at a very high level, we anticipate very big changes in the industry, and we deliver that technology at scale," Mollenkopf said.
This focus has helped the company provide device manufacturers with industry-leading technology, a point becoming increasingly pertinent as more and more OEMs move toward integration with the Internet of Things. Mollenkopf noted that, cumulatively, the company has dedicated more than $38 billion to R&D—highlighting the paramount importance the company places on inventing and developing new technologies.
The company, he continued, will focus on eight select areas and industries that Mollenkopf believes can be radically transformed by Qualcomm technology: automotive, smart cities, wearables, networking, smart homes, data centers, healthcare, and smartphones.
And while disruptive invention for some of these sectors is still to come, Mollenkopf announced a medley of products and solutions with Qualcomm technology built in.
Mollenkopf and executive vice-president of electronic development at Audi AG, Ricky Hudi, announced Qualcomm’s partnership with Audi, which tapped the Qualcomm Snapdragon 602A processor for the company’s second-generation modular infotainment platform (MIB)—a comprehensive automotive solution, capable of doing everything from delivering infotainment to enabling drivers’ attention to stay on the road.
Mollenkopf also announced the first commercial appearance of the flagship Snapdragon 820 processor in the Letv Le Max Pro. Mollenkopf discussed the Le Max Pro’s use of Qualcomm Snapdragon Sense ID 3D fingerprint technology, an advanced ultrasonic fingerprint reading technology designed to deliver a better user experience as well as more stringent security.
Before stepping off stage, Mollenkopf invited attendees to visit the company’s booth at CES, encouraging them to see these technologies in action, and experience what converged, connected technology at scale means for partners and users.
Stay tuned for more updates on Qualcomm and partners at CES 2016.