OnQ

Wistron introduces Smart Unit, a Snapdragon 210 based IoT module

7 sept. 2015

Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Wistron, a Taiwan-based, global technology services company, has introduced its first module based on the Qualcomm Snapdragon 210 processor that is designed specifically for Internet of Everything (IoE) applications . Dubbed the Smart Unit/SPK-QC, it includes not only the Snapdragon 210 processor, but also Wi-Fi and Bluetooth technology provided by a Qualcomm WCN36608, the Qualcomm WCN9326 audio codec, and Qualcomm PM8909 power management with Qualcomm Quick Charge.

Learn more about Internet of Everything solutions.

The company took a three-pronged approach to developing its Smart Unit module. First, the module had to have the ability to sense something about its surroundings—temperature, altitude, or motion, for example. It also had to be autonomous: The data it collected had to transfer automatically to a central processing location. Finally, it had to be actionable: The data had to be integrated directly into existing business processes.

Developers and manufacturers will appreciate the wide variety of features that can be enabled on the Smart Unit. With support for LCD screens, touch panels, NFC, 2.4- and 5GHz Wi-Fi, Bluetooth 4.0, and Bluetooth Low Energy (BLE), as well as camera support and light and temperature sensors, the Wistron Smart Unit sub-system can bring connectivity, intelligence, and applications into myriad types of products to make them “smarter.” Home appliances, smart speakers, remote controls, home automation hubs, and smart displays are just a few examples. The Wistron module supports various IoE communications protocols, including Microsoft Athena.

As an ODM and system integration provider, Wistron works with application developers to offer a comprehensive solution for the IoE ecosystem, on device and cloud. Learn more at the Wistron web site.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.