May 9, 2014
Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
3G still accounts for a majority of global mobile broadband coverage and network traffic, despite the rapid proliferation of 4G LTE around the world. Moreover, innovative 3G use cases such as multi-SIM that supports multiple networks on one device are furthering the growth of 3G, especially in developing countries.
Integrated in the Qualcomm® Snapdragon™ 200 processor that just launched on an LG smartphone LG L70 in Brazil is 3G modem technology that enables Triple SIM Triple Standby (TSTS) and 21 Mbps download speeds. This is one of many enabling technologies found in a Snapdragon processor and goes to show how Qualcomm Technologies is continuing to innovate in the high-volume tier and broaden the connectivity options available to users of multi-SIM mobile devices.
What is multi-SIM? Multi-SIM mobile devices are very popular in emerging regions and typically include dual SIM and triple SIM configurations. These allow mobile users to subscribe to multiple networks simultaneously from one device, either in standby (only one active network) or in active (multiple active network connections).
For mobile users in Brazil, triple-SIM is a highly desirable configuration, as typical pre-paid plans offered by Brazilian network providers allow users to make free in-network calls. By enabling access to high -speed (up to 21 Mbps) data on the primary SIM in addition to free voice calls on all SIMs, the TSTS modem in Snapdragon 200 makes triple SIM smartphones an even more appealing option for users.
Other benefits of multi-SIM devices are that users can avoid voice and data roaming charges by having a local and a foreign SIM—a boon for global travelers—as well as manage different working environments such as home and business with separate phone numbers.
Multi-SIM is challenging from a design standpoint as it impacts the entire modem design from the antenna through the modem protocol stack and up to the user interface. The latest TSTS Gobi™ modem overcomes the restrictions imposed by sharing of radio resources across three subscriptions to enable peak HSPA+ data rates of 21 Mbps on the primary SIM.
At the recently held Mobile World Congress show in Barcelona, Qualcomm Technologies also demonstrated its state-of the-art 4G LTE dual SIM mobile platform. As 3G and 4G LTE penetration continues to grow at a sharp pace, Qualcomm Technologies’ well rounded multi-SIM technology portfolio is prepared to address the diverse multi-SIM needs of mobile users across multiple smartphone tiers worldwide. Watch for the first dual SIM LTE devices anticipated to launch in China soon.