November 15, 2012PJ Jacobowitz
Today Qualcomm’s partners began receiving samples of our third generation Qualcomm Gobi LTE chips – our latest and greatest cellular modems. The MDM9225 and MDM9625 will be the first chips to contain new LTE and HSPA+ modems, which are faster and use less power than their predecessors.
Qualcomm Gobi LTE chips are used by our partners to add cellular connectivity to their products, including smartphones, tablets, notebooks, portable hotspots, dongles and more. Gobi allows these devices to connect to the Internet at fast 4G LTE speeds. But they’re also backwards compatible with older 3G and 2G cellular technologies, making it possible to find a cellular connection almost anywhere.
Qualcomm announced development of the newest Gobi LTE chips in February. Now that our partners have received samples, we expect devices with the chips to be available for purchase in 2013. Qualcomm Gobi’s features include:
First chip with a LTE Advanced Modem
-Delivers theoretical speeds of up to 1 gigabits per second.
First chip with a LTE Category 4 Modem
-Delivers theoretical speed of up to 150 megabits per second.
First chip with a 3GPP Release 10 Multicarrier HSPA+ (MC-HSPA+) Modem
-Theoretical speeds up to 84 Mbps
The new Qualcomm Gobi Chips will consume less power than their predecessors and continue to be manufactured using the 28nm process. The overall size of the board has also been reduced, both of which will help partners build sleeker products with longer battery life.
For more information, visit http://www.qualcomm.com/chipsets/gobi
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