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Qualcomm Dragonwing™
Wireless Broadband
Development Platform

Comprehensive hardware and software development platform with robust interfaces designed to accelerate product development.

The Dragonwing Wireless Broadband Development Platform is designed for developers to accelerate product development with early access to supportive tools, reducing the time to market. This comprehensive platform includes the development board, software access, robust Qualcomm® tools, and documentation. It features the Qualcomm® X85 5G Modem-RF platform for leading wireless connectivity and integrated AI for unrivaled performance, efficiency, speeds, and spectrum flexibility. The Dragonwing Wireless Broadband Development Platform is de...

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Benefits

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Earlier availability
Development kit available now for select customers to enable parallel development, thereby reducing time to market.
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Comprehensive development support
Easily find resources and software to accelerate your design.
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Robust interfaces
Designed to support a wide range of applications with robust interfaces, including USB-C, nano SIM, RJ45, SFP+, SDX85 LGA module with Sub-6 RF connectors, JTAG, DC power, SLIC interface, and a display connector.
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Unparalleled performance
Brings the best of cellular and Wi-Fi, with integrated AI and advanced Modem-RF technologies.

Features

  • Qualcomm 5G AI Processor with dedicated tensor accelerator hardware optimized for 5G and 5G Advanced use cases with 30%* faster AI inference for better performance
  • Qualcomm® AI-Powered Data Traffic Engine for better end user experience and performance
  • AI-enhanced, dynamic gaming traffic prioritization
  • Qualcomm® Advanced Modem-RF Software Suite—on-device, learning based network selection
  • 5G NR-based GNSS Location
  • 6x CA with 400MHz bandwidth
  • 1024 QAM Sub-6GHz support
  • Supports all global 5G Sub-6 bands
  • Switched uplink with Rel-17 (FDD/TDD)
  • UL 4 Layer Carrier Aggregation (200MHz)
  • 3GPP Release 18 support
  • Qualcomm® RF Downlink Boost • Qualcomm® 5G PowerSave
  • USB-C/micro-B, nano SIM, microSD card, RJ45, SFP+, Sub-6 RF connectors, JTAG, LGA module socket, DC jack, display

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