Joint public statement by MediaTek and Qualcomm

MediaTek and Qualcomm provide the following statement regarding their relationship and agreements between them.

First, neither MediaTek nor Qualcomm has lodged any complaint against the other – formally, informally, or otherwise – to the U.S. Federal Trade Commission (FTC), the U.S. International Trade Commission (ITC), or any other government agency in any country.

Second, the patent agreements that MediaTek and Qualcomm entered into roughly four years ago have not been abolished, repealed, or terminated. However, MediaTek and Qualcomm have recently agreed to amend those agreements in certain ways, as well as to suspend certain portions of those agreements.

Under those amendments, the contractual provisions relating to MediaTek reporting information to Qualcomm regarding MediaTek’s sales of CDMA and WCDMA chipsets have been amended. The particular amendments to MediaTek’s reporting obligations are confidential.

The original agreements between MediaTek and Qualcomm were not, and the amended agreements are not, “license” (or “licensing”) agreements. MediaTek does not have a license to any of Qualcomm’s patents, and Qualcomm does not have a license to any of MediaTek’s patents.

The amended agreements do not prohibit either Qualcomm or MediaTek from selling chipsets to any customer. Under the amended agreements, neither Qualcomm nor MediaTek receives any patent rights of each other that can be conveyed to another party.

Finally, the patent agreements between MediaTek and Qualcomm (including the recent amendments) are not intended to change any obligation (including any reporting or royalty obligations) any customer may have under any agreement with Qualcomm or MediaTek. Compared to customers of other chipset suppliers, MediaTek customers are under no different obligations with respect to any license agreements they may have with Qualcomm or with respect to the need to license any Qualcomm patents that they may use in their products. Likewise, compared to customers of other chipset suppliers, Qualcomm customers are under no different obligations with respect to any license agreements they may have with MediaTek or with respect to the need to license any MediaTek patents that they may use in their products. By this statement, neither MediaTek nor Qualcomm advises any other party as to its own legal rights or obligations, as to which such party should obtain its own legal counsel.

The terms of the amended agreements are confidential and will not be discussed further by either company.

The English version is the official version and in the event of any inconsistencies or discrepancies between the English version and either Chinese version, please refer to the English version.


联发科技与美国高通公司联合公开声明 联发科技与美国高通公司就双方之间的关系及协议做出以下声明:

首先,联发科技和美国高通公司均未曾以正式、非正式或其它方式于美国联邦贸易委员会(U.S. Federal Trade Commission, FTC)、美国国际贸易委员会(U.S. International Trade Commission, ITC)或其它任何国家的政府机构,向对方提出控诉。

其次,联发科技和美国高通公司约四年前签订的专利协议并未被废除、撤销或终止,但联发科技和美国高通公司双方于近日同意针对前述专利协议从某些方面进行修订,并中止该专利协议中部分条款的适用。
根据修订内容,有关联发科技向美国高通公司报告其CDMA和WCDMA芯片组销售信息的协议条款已经修改。有关联发科技报告义务的具体修订内容属保密信息。

联发科技和美国高通公司的原专利协议并非专利授权(license 或licensing)协议,其修订协议亦然。联发科技并未获得美国高通公司的任何专利授权,而美国高通公司亦未获得联发科技的任何专利授权。
该修订协议并不禁止美国高通公司或联发科技向任何客户销售芯片组。根据该修订协议,美国高通公司或联发科技均未自对方取得任何可以转让给第三方的专利相关权利。

最后,联发科技和美国高通公司之间的专利协议(包括最近的修订)并无意改变任何客户与美国高通公司或联发科技间可能存在的任何协议下的责任和义务(包括任何报告或支付权利金的责任和义务)。就联发科技的客户与美国高通公司可能签有的专利授权协议,或该客户可能因于其产品使用美国高通公司的专利而需向美国高通公司获得的授权而言,联发科技的客户与其它芯片供应商的客户所承担的责任和义务并无不同。同样地,就美国高通公司的客户与联发科技可能签有的专利授权协议,或该客户可能因于其产品使用联发科技的专利而需向联发科技获得的授权而言,美国高通公司的客户与其它芯片供应商的客户所承担的责任和义务并无不同。此声明并非联发科技或美国高通公司对任何第三方之法律权利或责任和义务的建议,对此第三方应咨询其各自法律顾问。

修订协议的条款属保密信息,联发科技和美国高通公司均不会对此做进一步评论。

本联合公开声明的英文版为正式版本。倘若英文版与中文翻译版之间存在任何出入或差异,请参照英文版为准。


聯發科技與美國高通公司共同公開聲明

聯發科技與美國高通公司針對其二者間之關係及合約提供以下聲明:

首先,不論聯發科技或美國高通公司均未曾於美國聯邦貿易委員會(U.S. Federal Trade Commission, FTC), 美國國際貿易委員會(U.S. International Trade Commission, ITC)或其他任何國家之政府機構,向對方提出正式、非正式或其他之控訴。

再者,聯發科技與美國高通公司於約四年前簽訂之專利協議並未被廢除、撤銷或終止。然聯發科技與美國高通公司雙方在近日同意針對前述專利協議從某些方面進行修改,並中止該專利協議中部分條款之適用。

依據修正內容,有關聯發科技向美國高通公司報告其CDMA與WCDMA晶片組銷售資訊之契約條款已經修改。有關聯發科技報告義務之具體修改內容係屬機密。

聯發科技與美國高通公司之原專利協議並非專利授權(license 或licensing)契約,其增補協議亦然。聯發科技並未取得美國高通公司之任何專利授權,而美國高通公司亦未取得聯發科技之任何專利授權。

該增補協議並不禁止美國高通公司或聯發科技銷售其晶片組予任何客戶。惟依據該增補協議,美國高通公司或聯發科技均未自對方取得任何可轉讓予第三方之專利相關權利。

最後,聯發科技與美國高通公司間之專利協議(包含最近之修正)並無意改變任何客戶與美國高通公司或聯發科技間可能存在之任何契約義務(包括任何報告或支付權利金之義務)。就聯發科技之客戶與美國高通公司可能簽有之專利授權契約,或該客戶可能因使用美國高通公司之專利於其產品而需要向美國高通公司取得授權而言,聯發科技之客戶與其他晶片供應商之客戶相比,其所負擔之義務並無不同。同樣地,就美國高通公司之客戶與聯發科技可能簽有之專利授權契約,或該客戶可能因使用聯發科技之專利於其產品而需要向聯發科技取得授權而言,美國高通公司之客戶與其他晶片供應商之客戶相比,其所負擔之義務亦無不同。此聲明並非聯發科技或美國高通公司對任何第三人之法律權利或義務之建議,第三人對此應自行洽詢其法律顧問。

增補協議之條款為保密內容,聯發科技與美國高通公司雙方均不會對此有進一步評論。

本共同公開聲明的英文版為正式版本。 倘若英文版與中文翻譯版之間存在任何出入或差異,請參照英文版為准