Qualcomm Dragonwing™
Robotics RB3 Platform
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RB3

A dedicated robotics platform designed to accelerate computing and connectivity capabilities for consumer and industrial robotics.

The Qualcomm Dragonwing™ Robotics RB3 Platform supports the development of smart, power-efficient, and cost-effective robots. The Qualcomm Robotics RB3 platform uses heterogeneous computing and Qualcomm® Artificial (AI) Engine to support on-device machine learning, computer vision, robust security, multimedia, Wi-Fi, and cellular connectivity capabilities. It is based on the Qualcomm® SDA845/Qualcomm® SDM845 SoC.

Comprised of a comprehensive set of hardware, software, and development tools, the Qualcomm Robotics RB3 platform is ...

Benefits
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On-device intelligence

The Qualcomm AI Engine includes the Qualcomm® Neural Processing SDK so that developers and manufacturers can port trained deep learning networks to various heterogeneous compute blocks.

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Hardware-based security

Includes security technology and is designed to provide a high level of robust security without compromising performance or power efficiency.

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Virtualization support

Supports porting of virtualization software to address advanced AI, machine learning, and biometric applications.

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Power efficient and cost-effective

Designed to support large industrial and enterprise devices as well as small battery-operated robots with challenging power and thermal dissipation requirements.

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Development support

Hardware and software development tools, resources and documentation accessible to begin development for robotics products.

Features

  • Qualcomm Spectra™ 280 ISP delivers high-performance capture of up to 13 megapixels at 60 FPS
  • Qualcomm® Adreno™ 630 Visual Processing Subsystem includes GPU, VPU, and DPU
  • 3rd Generation Qualcomm® Hexagon™ 685 DSP for sophisticated, on-device AI processing
  • Manufactured in 10nm LPP
  • Qualcomm® Kryo™ 385 CPU optimized across four performance and four efficiency cores
  • Support for Linux and ROS
  • Qualcomm® Processor Security technology includes the following key components: secure boot, cryptographic accelerators, Qualcomm® Trusted Execution Environment (QTEE) and camera security
  • Qualcomm® Neural Processing SDK to optimize deep learning processing performance across available resources to achieve superior edge computing experience
  • Qualcomm® Computer Vision with a mobile-optimized computer vision (CV) library which includes new user experiences like gesture recognition, face detection, tracking and recognition, text recognition and tracking, and augmented reality.
  • Hexagon DSP SDK to optimize features and performance of multimedia software to help allow audio, imaging, embedded vision, and heterogeneous computing acceleration
Specifications
RAM
Density
8 GB
Location
Satellite Systems
GLONASS, QZSS, Galileo, Beidou, SBAS, GPS
CPU
Name
Qualcomm® Kryo™ 385
Architecture
64-bit
Clock Speed
Up to 2.8 GHz
DSP
Name
Qualcomm® Hexagon™ 685
GPU
Name
Qualcomm® Adreno™ 630
APIs
OpenCL™ 2.0 Full, OpenGL® ES 3.2

Qualcomm Robotics Platform, Qualcomm Artificial Intelligence Engine, Qualcomm Neural Processing, Qualcomm SDA845, Qualcomm SDM845, Qualcomm Spectra, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Secure Processing Unit, and Qualcomm Computer Vision are products of Qualcomm Technologies, Inc. and/or its subsidiaries

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Product

IoT

Consumer Electronics

IoT

Industrial and Commercial

Bluetooth

Specification Version

Location

Satellite Systems

Wi-Fi

Channels

Wi-Fi

Features

Wi-Fi

Generation

Wi-Fi

MIMO Configuration

Wi-Fi

Spatial Streams

Wi-Fi

Spectral Bands

Wi-Fi

Standards

Series

Snapdragon Mobile Platform Series

Memory

Speed

Memory

Type

RAM

Density

Camera

Dual Camera

Camera

Image Signal Processor (ISP) Bit Depth

Camera

Image Signal Processor (ISP) Name

Camera

Image Signal Processor (ISP) Number

Camera

Single Camera

Camera

Slow Motion Video Capture

Display

Resolution

Video Playback

Codecs

Process Node and Technology

Process Node

CPU

Architecture

CPU

Clock Speed

CPU

Name

CPU

Number of Cores

DSP

Name

GPU

APIs

GPU

Name

Product Function

Application Processors

Product Tier

Tier

Technology

Technology Category

High Tier

Robotics

Manufacturing

Bluetooth® 5.0

GLONASS
QZSS
Galileo
Beidou
SBAS
GPS

40 MHz
20 MHz
80 MHz

MU-MIMO
Integrated baseband

Wi-Fi 4
Wi-Fi 5

2x2

Up to 2

2.4 GHz
5 GHz
60 GHz

802.11a
802.11b
802.11g
802.11n
802.11ac

8 Series

1866 MHz

LPDDR4x

8 GB

Up to 16 MP

14-bit

Qualcomm® Spectra™ 280

Dual ISP

Up to 32 MP

Up to 4K Ultra HD @ 60 fps

Ultra HD Premium (ready)

Hybrid Log Gamma (HLG)
H.264 (Advanced Video Coding (AVC))
H.265 (High Efficiency Video Coding (HEVC))
HDR10

10 nm

64-bit

Up to 2.8 GHz

Qualcomm® Kryo™ 385

8

Qualcomm® Hexagon™ 685

OpenCL™ 2.0 Full
OpenGL® ES 3.2

Qualcomm® Adreno™ 630

IoT

High

Mobile

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